US2016205781A1PendingUtilityA1

Flexible display apparatus and manufacturing method thereof

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Assignee: E INK HOLDINGS INCPriority: Nov 26, 2012Filed: Mar 17, 2016Published: Jul 14, 2016
Est. expiryNov 26, 2032(~6.3 yrs left)· nominal 20-yr term from priority
Inventors:Lih-Hsiung Chan
H05K 3/305H05K 1/028H05K 1/181H05K 1/189G02F 1/1345H05K 2201/10136H05K 2201/10977H05K 3/323G02F 1/13452
52
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Claims

Abstract

A flexible display apparatus including a flexible display panel, a flexible circuit board, a driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A flexible display apparatus, comprising:
 a flexible display panel having a display area and a bonding area located outside the display area;   a flexible circuit board disposed in the bonding area of the flexible display panel;   a driving chip disposed on the flexible circuit board; and   a sealing layer encapsulating a periphery of the flexible display panel and extendedly covering the bonding area and a portion of the flexible circuit board.   
     
     
         2 . The flexible display apparatus as recited in  claim 1 , further comprising:
 an anisotropic conductive film disposed between the flexible circuit board and the bonding area of the flexible display panel, wherein the flexible circuit board is electrically connected to the flexible display panel via the anisotropic conductive film.   
     
     
         3 . The flexible display apparatus as recited in  claim 2 , wherein the anisotropic conductive film comprising:
 an adhesive; and   a plurality of conductive particles distributed in the adhesive, wherein a diameter of each of the conductive particles ranges from 1 nm to 5 nm.   
     
     
         4 . The flexible display apparatus as recited in  claim 1 , wherein a location of the driving chip does not overlap with a location of the flexible display panel. 
     
     
         5 . The flexible display apparatus as recited in  claim 1 , further comprising:
 an external circuit connected to the flexible circuit board, wherein the flexible display panel is electrically connected to the external circuit via the flexible circuit board.   
     
     
         6 . The flexible display apparatus as recited in  claim 1 , further comprising:
 a protective layer disposed on a bottom surface of the flexible display panel and covering the bottom surface.   
     
     
         7 . The flexible display apparatus as recited in  claim 1 , further comprising:
 a protective layer disposed on a top surface of the flexible display panel, and the sealing layer covering the flexible circuit board and the protective layer.   
     
     
         8 . A flexible display apparatus, comprising:
 a flexible display panel having a display area and a bonding area located outside the display area;   a flexible circuit board disposed in the bonding area of the flexible display panel;   a driving chip disposed on the flexible circuit board; and   a hot-melt protective layer covering the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board.   
     
     
         9 . The flexible display apparatus as recited in  claim 8 , further comprising:
 an anisotropic conductive film disposed between the flexible circuit board and the bonding area of the flexible display panel, wherein the flexible circuit board is electrically connected to the flexible display panel via the anisotropic conductive film.   
     
     
         10 . The flexible display apparatus as recited in  claim 9 , wherein the anisotropic conductive film comprising:
 an adhesive; and   a plurality of conductive particles distributed in the adhesive, wherein a diameter of each of the conductive particles ranges from 1 nm to 5 nm.   
     
     
         11 . The flexible display apparatus as recited in  claim 8 , wherein a location of the driving chip does not overlap with a location of the flexible display panel. 
     
     
         12 . The flexible display apparatus as recited in  claim 8 , further comprising:
 an external circuit connected to the flexible circuit board, wherein the flexible display panel is electrically connected to the external circuit via the flexible circuit board.   
     
     
         13 . The flexible display apparatus as recited in  claim 8 , further comprising:
 a protective layer disposed on a bottom surface of the flexible display panel and covering the bottom surface.   
     
     
         14 . The flexible display apparatus as recited in  claim 13 , wherein a material of the protective layer comprising polyethylene terephthalate. 
     
     
         15 . The flexible display apparatus as recited in  claim 8 , wherein a material of the hot-melt protective layer comprises polyethylene terephthalate mixed with a hot-melt material, a weight percentage of the hot-melt material is 30% to 60%, and the hot-melt material comprises Polyurethane or Ethylene-Vinyl Acetate. 
     
     
         16 . A manufacturing method of a flexible display apparatus, comprising:
 providing a substrate;   forming a flexible display panel on the substrate, wherein the flexible display panel has a display area and a bonding area located outside the display area;   bonding a driving chip on the bonding area of the flexible display panel via at least one flexible circuit board;   forming a hot-melt protective layer on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board;   performing a heating step to soften the hot-melt protective layer; and   separating the flexible display panel from the substrate.   
     
     
         17 . The manufacturing method of the flexible display apparatus as recited in  claim 16 , wherein the step of forming the flexible display panel on the substrate comprises:
 forming an adhesive layer on the substrate; and   forming the flexible display panel on the substrate, wherein the flexible display panel is adhered to the substrate via the adhesive layer.   
     
     
         18 . The manufacturing method of the flexible display apparatus as recited in  claim 16 , wherein the driving chip is disposed on the flexible circuit board, and a location of the driving chip does not overlap with a location of the flexible display panel. 
     
     
         19 . The manufacturing method of the flexible display apparatus as recited in  claim 16 , wherein the flexible circuit board is bonded to the bonding area of the flexible display panel via an anisotropic conductive film. 
     
     
         20 . The manufacturing method of the flexible display apparatus as recited in  claim 16 , further comprising:
 after separating the flexible display panel from the substrate, bonding an external circuit to the flexible circuit board, wherein the flexible display panel is electrically connected to the external circuit via the flexible circuit board.   
     
     
         21 . The manufacturing method of the flexible display apparatus as recited in  claim 16 , wherein a temperature of the heating step is between  70 ° C. and  140 ° C. 
     
     
         22 . The manufacturing method of the flexible display apparatus as recited in  claim 16 , further comprising:
 after separating the flexible display panel from the substrate, bonding a protective layer to a bottom surface of the flexible display panel.

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