Solder piece, chip solder and method of fabricating solder piece

Abstract

A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.

1 . A piece of solder available for vacuum pickup, comprising:
 a solder piece that has a rectangular parallelepiped shape having four elongate rectangular planar surfaces, consisting of a planar rectangular first surface, a planar rectangular second surface opposite and parallel with the first surface, a planar rectangular third surface, a planar rectangular fourth surface opposite and parallel with the third surface, a convex fifth surface including a shear droop portion, and a rectangular sixth surface, opposite the fifth surface, the sixth surface having a surface shape defined or formed by a punch, and wherein the first through fourth surfaces are sheared surfaces and each one of the first through fourth surfaces is suitable to be used as a vacuum pickup surface, but neither the fifth surface nor the sixth surface is suitable to be used as a vacuum pickup surface, and wherein a distance between the fifth and sixth surfaces is greater than a distance between the first and second surfaces and is greater than a distance between the third and fourth surfaces, and wherein the sixth surface has an area that is smaller than an area of each of the first through fourth surfaces.