Methods of forming panel embedded die structures

Abstract

Methods of forming molded panel coreless package structures are described. Those methods and structures may include fabrication of embedded die packages using large panel format and use of molding to improve rigidity of the panel, as well as to embed the die in a non-sacrificial mold material. The methods and structures described include methods for manufacturing thin, coreless substrate architectures which possess low warpage.

What is claimed is: 
     
         1 . A package structure comprising;
 a coreless substrate comprising a mold material coupled to at least one build up layer, wherein the mold material is non-sacrificial; and   a die coupled to the coreless substrate.   
     
     
         2 . The package structure of  claim 1 , further comprising wherein the die is embedded in the mold material, and wherein the die comprises conductive interconnect structures. 
     
     
         3 . The package structure of  claim 2 , further comprising conductive bumps coupled to the at least one build up layer, wherein the conductive interconnect structures are coupled to the conductive bumps. 
     
     
         4 . The package structure of  claim 1 , further comprising wherein the package structure further comprises package on package land structures. 
     
     
         5 . The package structure of  claim 1 , wherein the package structure comprises a portion of one of a 3D multi-chip package substrate, and a BBUL package structure. 
     
     
         6 . The package structure of  claim 1 , wherein the mold material comprises an epoxy material. 
     
     
         7 . The package structure of  claim 1 , wherein the package structure is coupled with a CPU. 
     
     
         8 . The package structure of  claim 1 , wherein the package structure comprises a portion of a system on a chip. 
     
     
         9 . The package structure of  claim 1 , further comprising a system comprising:
 a bus communicatively coupled to the package structure; and   an eDRAM communicatively coupled to the bus.   
     
     
         10 . The package structure of  claim 1 , wherein the mold material is capable of providing rigidity to the package structure. 
     
     
         11 . A package structure comprising;
 a coreless substrate comprising a mold material coupled to at least one build up layer, wherein the mold material is non-sacrificial; and   a die embedded in the molding material, wherein the die includes conductive interconnect structures extending from a surface of the die, wherein the conductive interconnect structures extend through the mold material and are electronically connected to the at least one build up layer.   
     
     
         12 . The package structure of  claim 11 , further comprising a backside film abutting the die on a surface opposing the surface of the die having the conductive interconnect structures extending therefrom. 
     
     
         13 . The package structure of  claim 12 , further comprising a thin molding material abutting the backside film and the mold material. 
     
     
         14 . The package structure of  claim 11 , further comprising forming bumps on the at least one build up layer. 
     
     
         15 . The package structure of  claim 14 , wherein the conductive interconnect structures are electrically coupled to the conductive bumps through the at least one build up layer. 
     
     
         16 . The package structure of  claim 11 , wherein the mold material comprises an epoxy material. 
     
     
         17 . A package structure comprising;
 a coreless substrate comprising a mold material coupled to at least one build up layer, wherein the mold material is non-sacrificial; and   a die abutting in the mold material, wherein the die includes conductive interconnect structures extending therefrom, wherein the conductive interconnect structures extend through the mold material and are electronically connected to the at least one build up layer.   
     
     
         18 . The package structure of  claim 11 , further comprising conductive bumps coupled to the at least one build up layer. 
     
     
         19 . The package structure of  claim 18 , wherein the conductive interconnect structures are electrically coupled to the conductive bumps through the at least one build up layer. 
     
     
         20 . The package structure of  claim 17 , wherein the mold material comprises an epoxy material.