Electronic component, method of manufacturing the same, and mount structure of electronic component

Abstract

An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.

What is claimed is: 
     
         1 . A method of manufacturing an electronic component comprising the steps of:
 forming a first external electrode and a second external electrode on a portion of a surface of an electronic component main body; and   providing on another portion of the surface of the electronic component main body and on a surface of the first external electrode, a water-repellent film containing a non-cross-linked silicone resin, of which an angle of contact with water of about 25° C. is not less than about 100° and not greater than about 160°.   
     
     
         2 . The method of manufacturing an electronic component according to  claim 1 , wherein in the step of providing the water-repellent film, the water-repellent film is provided by immersing the electronic component main body including the first and second external electrodes formed thereon in a treatment solution containing the non-cross-linked silicone resin, followed by drying. 
     
     
         3 . The method of manufacturing an electronic component according to  claim 1 , wherein each of the first and second external electrodes are formed so as to include a plurality of layers, and an outermost layer of each of the first and second external electrodes contains at least one of Sn, Cu, and Ag. 
     
     
         4 . The method of manufacturing an electronic component according to  claim 1 , wherein the water-repellent film is formed to extend across the another portion of the surface of the electronic component main body and a surface of the first external electrode. 
     
     
         5 . The method of manufacturing an electronic component according to  claim 1 , wherein the water-repellent film is formed to cover an entire surface of an exposed portion of the electronic component main body and each of the first and second external electrodes.