Smart Material Coupler

Abstract

An apparatus is used to dissipate heat. The apparatus includes a heat sink, an electronic component, and a coupler. The coupler includes a smart material movable into an engaged position such as to be engaged with the heat sink to dissipate heat from the electronic component to the heat sink through the coupler.

What is claimed is: 
     
         1 . An apparatus to dissipate heat, the apparatus comprising:
 a heat sink;   an electronic component; and   a coupler comprising a smart material movable into an engaged position such as to be engaged with the heat sink to dissipate heat from the electronic component to the heat sink through the coupler.   
     
     
         2 . The apparatus of  claim 1 , wherein the coupler is movable into the engaged position when the electronic component receives power. 
     
     
         3 . The apparatus of  claim 2 , wherein power is received by the coupler when power is received by the electronic component to be movable into the engaged position. 
     
     
         4 . The apparatus of  claim 1 , wherein:
 the coupler is movable between the engaged position and a disengaged position such as to not be engaged with the heat sink,   the coupler is movable to the engaged position when power is received by the electronic component, and   the coupler is movable to the disengaged position when power is not received by the electronic component.   
     
     
         5 . The apparatus of  claim 4 , wherein the coupler is movable to the engaged position when a voltage or a current above a predetermined amount is received by the coupler. 
     
     
         6 . The apparatus of  claim 4 , wherein the coupler is movable to the engaged position when temperature above a predetermined amount is sensed by the coupler. 
     
     
         7 . The apparatus of  claim 1 , wherein the heat sink comprises a housing, and wherein the electronic component is positioned within the housing. 
     
     
         8 . The apparatus of  claim 7 , wherein:
 the housing comprises a housing radius,   the coupler comprises a coupler radius,   the coupler radius is larger than the housing radius when power is received by the electronic component, and   the coupler radius is smaller than the housing radius when power is not received by the electronic component.   
     
     
         9 . The apparatus of  claim 1 , wherein the smart material comprises at least one of a piezoelectric material, a temperature-dependent shape-memory material, a stress-dependent shape-memory material, a magnetic-dependent shape-memory material, an electric-dependent shape-memory material, a pH-dependent material, and a moisture-dependent shape-memory material. 
     
     
         10 . The apparatus of  claim 1 , further comprising a chassis positioned between the electronic component and the coupler. 
     
     
         11 . The apparatus of  claim 1 , further comprising a controller coupled to the coupler. 
     
     
         12 . The apparatus of  claim 1 , wherein the housing comprises a subsea component. 
     
     
         13 . A subsea apparatus to dissipate heat, the apparatus comprising:
 a subsea heat sink;   an electronic component; and   a coupler comprising a smart material movable between an engaged position such as to be engaged with the subsea heat sink to dissipate heat from the electronic component to the subsea housing through the coupler when in the engaged position and a disengaged position such as to not be engaged with the subsea heat sink.   
     
     
         14 . The apparatus of  claim 13 , wherein the coupler is movable to the engaged position when power is received by the electronic component, and wherein the coupler is movable to the disengaged position when power is not received by the electronic component. 
     
     
         15 . The apparatus of  claim 14 , wherein power is received by the coupler when power is received by the electronic component to be movable into the engaged position, and wherein power is not received by the coupler when power is not received by the electronic component to be movable into the disengaged position. 
     
     
         16 . The apparatus of  claim 13 , wherein the coupler is movable to the engaged position when a voltage or a current above a predetermined amount is received by the coupler. 
     
     
         17 . The apparatus of  claim 13 , wherein the coupler is movable to the engaged position when temperature above a predetermined amount is sensed by the coupler. 
     
     
         18 . The apparatus of  claim 13 , wherein:
 the subsea heat sink comprises a subsea housing;   the electronic component is positioned within the subsea housing;   the subsea housing comprises a housing radius,   the coupler comprises a coupler radius,   the coupler radius is larger than the housing radius when the coupler is in the engaged position, and   the coupler radius is smaller than the housing radius when the coupler is in the disengaged position.   
     
     
         19 . The apparatus of  claim 13 , wherein the smart material comprises at least one of a piezoelectric material, a temperature-dependent shape-memory material, a stress-dependent shape-memory material, a magnetic-dependent shape-memory material, an electric-dependent shape-memory material, a pH-dependent material, and a moisture-dependent shape-memory material. 
     
     
         20 . The apparatus of  claim 13 , further comprising:
 a chassis positioned between the electronic component and the coupler; and   a controller coupled to the coupler.   
     
     
         21 . The apparatus of  claim 13 , wherein the subsea heat sink comprises a component in the oil and gas industry.