Resin composition, resist pattern-forming method and polymer
Abstract
A resin composition comprises a polymer comprising a structural unit that comprises a group represented by formula (1), and a solvent. In the formula (1), R 1 to R 4 each independently represent a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms, wherein at least one of R 1 to R 4 has the fluorine atom or a group including the fluorine atom. R 5 represents a substituted or unsubstituted trivalent chain hydrocarbon group having 1 to 7 carbon atoms. * denotes a binding site to other moiety of the structural unit. The structural unit is preferably represented by any one of formulae (2-1) to (2-3). In the formulae (2-1) to (2-3), Z represents a group represented by formula (1).
Claims
exact text as granted — not AI-modified1 . A resin composition comprising:
a polymer comprising a structural unit that comprises a group represented by formula (1); and a solvent,
wherein, in the formula (1),
R 1 to R 4 each independently represent a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms, wherein at least one of R 1 to R 4 represents the fluorine atom or a group comprising the fluorine atom;
R 5 represents a substituted or unsubstituted trivalent chain hydrocarbon group having 1 to 7 carbon atoms; and
* denotes a binding site to other moiety of the structural unit.
2 . The resin composition according to claim 1 , wherein the structural unit is represented by any one of formulae (2-1) to (2-3):
wherein, in the formulae (2-1) to (2-3), Z represents the group represented by the formula (1),
wherein, in the formula (2-1), R 6 represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group,
wherein, in the formula (2-2),
R 7 represents a hydrogen atom or a methyl group;
R 8 , R 9 and R 10 each independently represent a hydrogen atom, a halogen atom, a hydroxy group or a monovalent organic group having 1 to 20 carbon atoms, or at least two of one or a plurality of R 8 (s) and one or a plurality of R 9 (s) and R 10 optionally taken together represent a ring structure having 3 to 20 ring atoms;
a is an integer of 1 to 4,
wherein in a case where a is no less than 2, a plurality of R 8 s are identical or different with each other, and a plurality of R 9 s are identical or different with each other; and
L represents a single bond or a divalent linking group, wherein R 10 and L optionally taken together represent a ring structure having 3 to 20 ring atoms, together with the carbon atom to which R 10 and L bond, and
wherein, in the formula (2-3),
R 11 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and E represents a single bond or a divalent linking group.
3 . The resin composition according to claim 1 , wherein the group comprising the fluorine atom is a group represented by formula (a):
wherein, in the formula (a), R a and R b each independently represent a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 19 carbon atoms.
4 . The resin composition according to claim 1 , wherein in the formula (1), at least one of R 3 and R 4 comprises —COO—.
5 . The resin composition according to claim 1 , further comprising a radiation-sensitive acid generator.
6 . The resin composition according to claim 5 , further comprising a polymer comprising a structural unit that comprises an acid-labile group, and having a lower percentage content of fluorine atoms than a percentage content of fluorine atoms of the polymer comprising the structural unit that comprises the group represented by the formula (1).
7 . A laminate structure comprising:
a resist film; and a protective film which is a cured product of the resin composition according to claim 1 , and which is overlaid on the resist film.
8 . A resist pattern-forming method comprising:
applying the resin composition according to claim 5 directly or indirectly on a substrate to form a resist film; exposing the resist film; and developing the resist film exposed.
9 . A resist pattern-forming method comprising:
forming a resist film; applying the resin composition according to claim 1 on the resist film to form a protective film overlaid on the resist film; subjecting the resist film having the protective film overlaid thereon to liquid immersion lithography; and developing the resist film subjected to the liquid immersion lithography.
10 . A polymer comprising a structural unit that comprises a group represented by formula (1):
wherein, in the formula (1),
R 1 to R 4 each independently represent a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms, wherein at least one of R 1 to R 4 represents the fluorine atom or a group comprising the fluorine atom;
R 5 represents a substituted or unsubstituted trivalent chain hydrocarbon group having 1 to 7 carbon atoms; and
* denotes a binding site to other moiety of the structural unit.Join the waitlist — get patent alerts
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