Heating type vaporizing device

Abstract

This invention is a continuous type vaporizing device that makes it possible to output a large flow rate of the material gas stably while the vaporizing device is downsized. The vaporizing device comprises a vaporizing tank that has a vaporizing chamber and that outputs a material gas that is produced by vaporizing the liquid material that is introduced into the vaporizing chamber, a heater that promotes vaporization of the liquid material in the vaporizing chamber by heating the vaporization tank, and a partition wall that partitions a lower space of the vaporizing chamber into a first lower space into which the liquid material is introduced first and a second lower space into which the liquid material that overflows from the first lower space is introduced.

1 . A vaporizing tank that has a vaporizing chamber heated by a heater and that outputs a material gas that is vaporized by heating a liquid material that is introduced into the vaporizing chamber, wherein
 comprising a partition wall that partitions a lower space of the vaporizing chamber into a first lower space into which the liquid material is introduced first and a second lower space into which the liquid material that overflows from the first lower space is introduced.   
     
     
         2 . The vaporizing tank described in  claim 1 , wherein
 a liquid surface height at which the liquid material starts overflowing into the second lower space is set within a target liquid surface height range or at a height higher than the target liquid surface height range.   
     
     
         3 . The vaporizing tank described in  claim 1 , wherein
 comprising a plurality of thermal conductors that project from an internal wall surface of the vaporizing chamber.   
     
     
         4 . The vaporizing tank described in  claim 3 , comprising a block shaped body where a bottomed hole that opens in a predetermined surface is formed and a cap body that forms the vaporizing chamber by closing the opening of the bottomed hole, wherein
 the bottomed hole is formed by boring multiple portions of the predetermined surface of the body, and   a remaining wall portion formed between the bottomed holes is so configured to perform a function as the thermal conductor.   
     
     
         5 . The vaporizing tank described in  claim 1 , wherein
 a wall body that forms the vaporizing chamber is so configured that the heater to apply the heat to the liquid material can be buried.   
     
     
         6 . A vaporizer comprising
 a vaporizing tank that has a vaporizing chamber and that outputs a material gas produced by vaporizing a liquid material introduced into the vaporizing tank,   a heater that applies heat to the vaporizing tank so as to promote vaporization of the liquid material in the vaporizing tank, and   a partition wall that partitions a lower space of the vaporizing chamber into a first lower space into which the liquid material is introduced first and a second lower space into which the liquid material that overflows from the first lower space is introduced.   
     
     
         7 . A vaporizing device comprising
 the vaporizer described in  claim 6 ,
 a liquid surface sensor that detects a liquid surface height of a liquid material stored in a vaporizing chamber, 
 a flow rate adjusting valve that is arranged on a liquid material introducing flow channel that communicates with the vaporizing chamber, and 
 a control mechanism that controls the flow rate adjusting valve so as to make the liquid surface height detected by the liquid surface sensor within a predetermined target liquid surface height range, wherein 
 the liquid surface height at which the liquid material overflows into the second lower space is set within or above the predetermined target liquid surface height range.