Channel marker and related methods

Abstract

Various embodiments of the disclosure include a component, methods of forming components, and methods of cooling components. In some embodiments, a method includes: forming a microchannel in a component; providing a marker member in the microchannel; and forming a thermal barrier coating (TBC) over the microchannel and a portion of the marker member to substantially seal the microchannel, wherein a portion of the marker member extends beyond an outer surface of the TBC after the forming of the TBC.

We claim: 
     
         1 . A method comprising:
 forming a microchannel in a component;   providing a marker member in the microchannel; and   forming a thermal barrier coating (TBC) over the microchannel and a portion of the marker member to substantially seal the microchannel, wherein a portion of the marker member extends beyond an outer surface of the TBC after the forming of the TBC.   
     
     
         2 . The method of  claim 1 , further comprising machining the marker member from a location external to the outer surface to expose the microchannel. 
     
     
         3 . The method of  claim 2 , wherein the machining includes performing electrical discharge machining to remove a portion of the marker member. 
     
     
         4 . The method of  claim 1 , wherein the providing includes welding at least one of a wire or a foil along at least one surface of the microchannel before the forming of the TBC. 
     
     
         5 . The method of  claim 1 , wherein the providing includes brazing at least one of a wire or a foil along at least one surface of the microchannel before the forming of the TBC. 
     
     
         6 . The method of  claim 1 , wherein the forming of the microchannel includes:
 forming a trough in the component; and   forming a shoulder at an edge of the trough.   
     
     
         7 . A method comprising:
 providing a component having:
 one of a microchannel or a film hole extending at least partially therethrough; 
 a thermal barrier coating (TBC) covering a portion of the one of the microchannel or the film hole; and 
 a marker member extending from the one of the microchannel or the film hole through the TBC or proximate an end of the one of the microchannel or the film hole; and 
   machining the marker member to expose the one of the microchannel or the film hole through the TBC.   
     
     
         8 . The method of  claim 7 , further comprising providing a cooling fluid to an inlet of the one of the microchannel or the film hole for cooling the component. 
     
     
         9 . The method of  claim 7 , wherein, in the case that the marker member extends from the one of the microchannel or the film hole through the TBC, the machining of the marker member includes machining the marker member from a location external to an outer surface of the TBC. 
     
     
         10 . The method of  claim 7 , wherein the marker member includes a metal. 
     
     
         11 . The method of  claim 10 , wherein the machining includes performing electrical discharge machining (EDM) to remove a portion of the marker member. 
     
     
         12 . The method of  claim 7 , wherein the providing includes:
 forming the one of the microchannel or the film hole in a component;   brazing or welding the marker member in the one of the microchannel or the film hole; and   forming the TBC over the one of the microchannel or the film hole and a portion of the marker member to substantially seal the one of the microchannel or the film hole.