Systems and methods for forming mems assemblies incorporating getters

Abstract

Systems and methods for forming MEMS assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (MEMS) assembly includes providing a first MEMS wafer including a metal layer on an inner surface and one or more cavities for forming a MEMS component, attaching a MEMS capping wafer, having at least one through hole via, to the inner surface of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via.

What is claimed is: 
     
         1 . A method for forming and bonding to a microelectromechanical systems (MEMS) assembly, the method comprising:
 providing a first MEMS wafer comprising a metal layer on an inner surface and one or more cavities for forming a MEMS component;   attaching a MEMS capping wafer, having at least one through hole via, to the metal layer of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer; and   bonding a wire to the metal layer through an open end of the at least one through hole via,   wherein a first cavity of the one or more cavities comprises a first conductive pad,   wherein a second cavity of the one or more cavities comprises a second conductive pad, and   wherein each of the first and second conductive pads comprises a getter material.   
     
     
         2 . The method of  claim 1 :
 wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer, and   wherein the attaching the MEMS capping wafer to the inner surface of the first MEMS wafer comprises attaching the one or more electrodes to the metal layer of the first MEMS wafer.   
     
     
         3 . The method of  claim 2 , wherein a first electrode of the one or more electrodes is positioned between a first through hole via of the at least one through hole via and a first cavity of the one or more cavities. 
     
     
         4 . The method of  claim 1 , wherein at least one of the one or more cavities comprises a conductive pad comprising a getter material. 
     
     
         5 . The method of  claim 4 , wherein the getter material comprises a metal selected from the group consisting of Ti and Cr. 
     
     
         6 . The method of  claim 4 , wherein the conductive pad comprises:
 a first layer on a substrate layer of the first MEMs wafer, the first layer comprising a getter material; and   a second layer on the first layer and comprising a metal.   
     
     
         7 . The method of  claim 1 , wherein the getter material comprises a metal selected from the group consisting of Ti and Cr. 
     
     
         8 . The method of  claim 1 , wherein the MEMS assembly forms one or more accelerometers. 
     
     
         9 . The method of  claim 1 , wherein the bonding the wire to the metal layer through the open end of the at least one through hole via comprises forming a ball comprising a portion of the wire, wherein the ball is bonded to the metal layer. 
     
     
         10 . The method of  claim 1 :
 wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer, and   wherein the inner surface of the MEMS capping wafer comprises oxide.   
     
     
         11 . A method for forming and bonding to a microelectromechanical systems (MEMS) assembly, the method comprising:
 providing a first MEMS wafer comprising a metal layer on an inner surface and one or more cavities for forming a MEMS component;   attaching a MEMS capping wafer, having at least one through hole via, to the metal layer of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer; and   bonding a wire to the metal layer through an open end of the at least one through hole via,   wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer,   wherein the attaching the MEMS capping wafer to the inner surface of the first MEMS wafer comprises attaching the one or more electrodes to the metal layer of the first MEMS wafer,   wherein a first electrode of the one or more electrodes is positioned between a first through hole via of the at least one through hole via and a first cavity of the one or more cavities, and   wherein a second electrode of the one or more electrodes is positioned between a second through hole via of the at least one through hole via and a second cavity of the one or more cavities.   
     
     
         12 . The method of  claim 11 , wherein the first electrode and the second electrode are electrically isolated.