III-Nitride Switching Device with an Emulated Diode

Abstract

Some exemplary embodiments of a III-nitride switching device with an emulated diode have been disclosed. One exemplary embodiment comprises a GaN switching device fabricated on a substrate comprising a high threshold GaN transistor coupled across a low threshold GaN transistor, wherein a gate and a source of the low threshold GaN transistor are shorted with an interconnect metal to function as a parallel diode in a reverse mode. The high threshold GaN transistor is configured to provide noise immunity for the GaN switching device when in a forward mode. The high threshold GaN transistor and the low threshold GaN transistor are typically fabricated on the same substrate, and with significantly different thresholds. As a result, the superior switching characteristics of III-nitride devices may be leveraged while retaining the functionality and the monolithic structure of the inherent body diode in traditional silicon FETs.

1 - 20 . (canceled) 
     
     
         21 . A III-nitride switching device comprising:
 a high threshold III-nitride transistor for being switched by a driver circuit;   a low threshold III-nitride diode connected transistor coupled across said high threshold III-nitride transistor at a common source node and a common drain node, said low threshold III-nitride diode having a gate and a source, said gate being coupled to said source at said common source node;   wherein said high threshold III-nitride transistor comprises a high threshold voltage more than four times larger than a low threshold voltage of said low threshold III-nitride diode connected transistor, and provides noise immunity for said III-nitride switching device in a forward mode;   wherein a low resistance interconnect metal connects said gate and said source of said low threshold III-nitride diode connected transistor so that said low threshold voltage of said low threshold III-nitride diode is substantially equal to a voltage drop of said low threshold III-nitride diode in a reverse mode;   wherein said low threshold III-nitride diode connected transistor functions as a parallel diode for protection of said III-nitride switching device in said reverse mode;   wherein said III-nitride switching device comprises at least one GaN HEMT.   
     
     
         22 . The III-nitride switching device of  claim 21 , wherein said high threshold III-nitride transistor comprises an E-mode GaN HEMT. 
     
     
         23 . The III-nitride switching device of  claim 21 , wherein said low threshold III-nitride diode connected transistor comprises an E-mode GaN HEMT. 
     
     
         24 . The III-nitride switching device of  claim 21 , wherein said gate and said source of said low threshold III-nitride diode connected transistor are shorted by said low resistance interconnect metal such that said low threshold III-nitride diode connected transistor functions as said parallel diode. 
     
     
         25 . The III-nitride switching device of  claim 21 , wherein said high threshold III-nitride transistor is formed by interrupting a 2-DEG conduction channel in said high threshold III-nitride transistor. 
     
     
         26 . The III-nitride switching device of  claim 25 , wherein said 2-DEG conduction channel is interrupted by trapping charges in a gate region of said high threshold III-nitride transistor. 
     
     
         27 . The III-nitride switching device of  claim 25 , wherein said 2-DEG conduction channel is interrupted by forming a recess under a gate of said high threshold III-nitride transistor. 
     
     
         28 . The III-nitride switching device of  claim 21 , wherein said III-nitride switching device is utilized as a switch in a half-bridge circuit. 
     
     
         29 . The III-nitride switching device of  claim 21 , wherein a voltage across a drain and a source of said high threshold III-nitride transistor is between approximately 40 and approximately 600 volts. 
     
     
         30 . A GaN switching device comprising:
 a high threshold GaN transistor fabricated on a substrate;   a low threshold GaN diode connected transistor fabricated on said substrate;   wherein a high threshold voltage of said high threshold GaN transistor is more than four times larger than a low threshold voltage of said low threshold GaN diode connected transistor;   wherein a gate and a source of said low threshold GaN diode connected transistor are shorted by a low resistance interconnect metal such that said low threshold voltage of said low threshold GaN diode connected transistor is substantially equal to a voltage drop of said low threshold GaN diode connected transistor in a reverse mode to function as a parallel diode;   a drain of said high threshold GaN transistor being shorted to a drain of said low threshold GaN diode connected transistor, and a source of said high threshold GaN transistor being shorted to said source of said low threshold GaN diode connected transistor;   wherein said GaN switching device comprises at least one GaN HEMT.   
     
     
         31 . The GaN switching device of  claim 30 , wherein said high threshold GaN transistor provides noise immunity for said GaN switching device in a forward mode. 
     
     
         32 . The GaN switching device of  claim 30 , wherein said low threshold GaN diode connected transistor functions as a parallel diode for protection of said GaN switching device in said reverse mode. 
     
     
         33 . The GaN switching device of  claim 30 , wherein said substrate is selected from the group consisting of a GaN substrate, a silicon carbide substrate, an alumina substrate, and a silicon only substrate. 
     
     
         34 . The GaN switching device of  claim 30 , wherein said high threshold GaN transistor is formed by interrupting a 2-DEG conduction channel in said high threshold GaN transistor. 
     
     
         35 . The GaN switching device of  claim 34 , wherein said 2-DEG conduction channel is interrupted by trapping charges in a gate region of said high threshold GaN transistor. 
     
     
         36 . The GaN switching device of  claim 30 , wherein said 2-DEG conduction channel is interrupted by forming a recess under a gate of said high threshold GaN transistor. 
     
     
         37 . The GaN switching device of  claim 30 , wherein a threshold voltage of said high threshold GaN transistor is greater than approximately 3 volts. 
     
     
         38 . The GaN switching device of  claim 30 , wherein a threshold voltage of said low threshold GaN diode connected transistor is less than approximately 0.7 volts.