Independent control of stacked electronic modules

Abstract

Apparatus and methods are disclosed to allow independent control of stacked memory modules. In one embodiment, an apparatus may comprise first, second, and third modules, each of the first, second and third modules having a plurality of stacked memory dice, at least some of the plurality of stacked memory dice including a Chip Enable (CE) signal electrically accessible from a bottom surface of a corresponding module of the first, second and third modules. The apparatus may comprise a Package-on-Package (PoP) structure where the first, second and third modules are attached to one another such that an individual access to each CE signal associated with the PoP structure is provided from the bottom surface of the corresponding module.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a plurality of stacked memory dice, at least some of the plurality of stacked memory dice including a Chip Enable (CE) signal connection electrically accessible from a surface of a corresponding one of the stacked memory dice while the die is in the stack, each of the plurality of stacked memory dice having the CE signal connection being configured to be controlled individually by a unique CE signal applied to the CE signal connection.