Package for a surface-mount semiconductor device and manufacturing method thereof

Abstract

A surface-mount electronic device includes a body of semiconductor material, a lead frame, which forms a plurality of contact terminals, and a package dielectric region, which overlies the semiconductor body. Each contact terminal includes an inner portion that is overlaid by the package dielectric region and an outer portion, which projects laterally beyond the package dielectric region and is delimited by a first lateral surface. The device further includes, for each contact terminal, an anti-oxidation layer, which is disposed on the corresponding first lateral surface.

1 . A surface-mount electronic device, comprising:
 a body of semiconductor material;   a lead frame forming a plurality of contact terminals; and   a package dielectric region overlying the body of semiconductor material; and   wherein each contact terminal comprises an inner portion overlaid by the package dielectric region and an outer portion projecting laterally beyond the package dielectric region and delimited by a first lateral surface; and   an anti-oxidation layer disposed on the first lateral surface.   
     
     
         2 . The surface-mount electronic device according to  claim 1 , wherein the package dielectric region forms an edge, at least part of said plurality of contact terminals extending along said edge. 
     
     
         3 . The surface-mount electronic device according to  claim 1 , wherein said each contact terminal is delimited by a bottom surface configured to be soldered to a printed-circuit board. 
     
     
         4 . The surface-mount electronic device according to  claim 1 , wherein said surface-mount electronic device is a quad-flat no-leads electronic device. 
     
     
         5 . The surface-mount electronic device according to  claim 1 , wherein said inner portion forms a second lateral surface, and wherein said outer portion is delimited at a top by a transverse surface, the transverse surface being connected to and transverse to the first and second lateral surfaces. 
     
     
         6 . The surface-mount electronic device according to  claim 5 , wherein the transverse surface is substantially perpendicular to the first lateral surface and the second lateral surface is inclined with respect to the first lateral surface at an angle between 8° and 12°. 
     
     
         7 - 20 . (canceled) 
     
     
         21 . A surface-mount electronic device, comprising:
 a body of semiconductor material;   a lead frame forming a plurality of contact terminals; and   a package dielectric region overlying the body of semiconductor material; and   wherein each contact terminal comprises an inner portion overlaid by the package dielectric region and an outer portion projecting laterally beyond the package dielectric region and delimited by a first lateral surface; and   wherein said inner portion forms a second lateral surface, and wherein said outer portion is delimited at a top by a transverse surface, the transverse surface being connected to and transverse to the first and second lateral surfaces.   
     
     
         22 . The surface-mount electronic device according to  claim 21 , wherein the package dielectric region forms an edge, at least part of said plurality of contact terminals extending along said edge. 
     
     
         23 . The surface-mount electronic device according to  claim 21 , wherein said each contact terminal is delimited by a bottom surface configured to be soldered to a printed-circuit board. 
     
     
         24 . The surface-mount electronic device according to  claim 23 , further comprising an anti-oxidation layer disposed on the first lateral surface. 
     
     
         25 . The surface-mount electronic device according to  claim 21 , wherein said surface-mount electronic device is a quad-flat no-leads electronic device. 
     
     
         26 . The surface-mount electronic device according to  claim 21 , wherein the transverse surface is substantially perpendicular to the first lateral surface. 
     
     
         27 . The surface-mount electronic device according to  claim 26 , wherein the second lateral surface is inclined with respect to the first lateral surface at an angle between 8° and 12°.