Substrate processing apparatus

Abstract

A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

1 . A substrate processing apparatus comprising:
 a polishing unit for polishing a peripheral portion of a substrate;   a cleaning unit for cleaning the substrate;   a drying unit for drying the substrate; and   a measurement unit for measuring the peripheral portion of the substrate.   
     
     
         2 . The substrate processing apparatus as recited in  claim 1 , further comprising a polishing condition decision unit for determining a polishing condition of said polishing unit based on a measurement result of the peripheral portion of the substrate measured by said measurement unit. 
     
     
         3 . The substrate processing apparatus as recited in  claim 2 , wherein said polishing unit includes a polishing mechanism for polishing the peripheral portion of the substrate at a desired polishing angle,
 wherein said polishing condition decision unit is configured to determine a polishing angle at which the peripheral portion of the substrate is polished in said polishing unit, based on the measurement result of the peripheral portion of the substrate measured by said measurement unit.   
     
     
         4 . The substrate processing apparatus as recited in  claim 1 , wherein said measurement unit includes a diameter measurement mechanism for measuring a diameter of the substrate. 
     
     
         5 . The substrate processing apparatus as recited in  claim 1 , wherein said measurement unit includes a cross-sectional shape measurement mechanism for measuring a cross-sectional shape of the peripheral portion of the substrate. 
     
     
         6 . The substrate processing apparatus as recited in  claim 1 , wherein said measurement unit includes a surface condition measurement mechanism for measuring a surface condition of the peripheral portion of the substrate to detect a defective portion in the peripheral portion of the substrate. 
     
     
         7 . The substrate processing apparatus as recited in  claim 1 , wherein said measurement unit includes a three-dimensional shape measurement mechanism for measuring a three-dimensional shape of the peripheral portion of the substrate. 
     
     
         8 . The substrate processing apparatus as recited in  claim 1 , wherein said measurement unit is disposed within said substrate processing apparatus. 
     
     
         9 . The substrate processing apparatus as recited in  claim 2 , wherein said measurement unit includes a diameter measurement mechanism for measuring a diameter of the substrate. 
     
     
         10 . The substrate processing apparatus as recited in  claim 3 , wherein said measurement unit includes a diameter measurement mechanism for measuring a diameter of the substrate. 
     
     
         11 . The substrate processing apparatus as recited in  claim 2 , wherein said measurement unit includes a cross-sectional shape measurement mechanism for measuring a cross-sectional shape of the peripheral portion of the substrate. 
     
     
         12 . The substrate processing apparatus as recited in  claim 3 , wherein said measurement unit includes a cross-sectional shape measurement mechanism for measuring a cross-sectional shape of the peripheral portion of the substrate. 
     
     
         13 . The substrate processing apparatus as recited in  claim 2 , wherein said measurement unit includes a surface condition measurement mechanism for measuring a surface condition of the peripheral portion of the substrate to detect a defective portion in the peripheral portion of the substrate. 
     
     
         14 . The substrate processing apparatus as recited in  claim 3 , wherein said measurement unit includes a surface condition measurement mechanism for measuring a surface condition of the peripheral portion of the substrate to detect a defective portion in the peripheral portion of the substrate. 
     
     
         15 . The substrate processing apparatus as recited in  claim 2 , wherein said measurement unit includes a three-dimensional shape measurement mechanism for measuring a three-dimensional shape of the peripheral portion of the substrate. 
     
     
         16 . The substrate processing apparatus as recited in  claim 3 , wherein said measurement unit includes a three-dimensional shape measurement mechanism for measuring a three-dimensional shape of the peripheral portion of the substrate.