Systems and methods for processing vapor

Abstract

A system for processing vapor. The system includes a vapor source for producing a vapor and an outlet conduit coupled to the vapor source for carrying the vapor from the vapor source. Downstream of the vapor source the outlet conduit separates into a vapor bypass conduit and a vapor feed conduit. The system further includes a first vapor control valve disposed in the bypass conduit, a second vapor control valve disposed in the feed conduit, a first vacuum chamber connected to the bypass conduit, and a second vacuum chamber connected to the feed conduit.

What is claimed is: 
     
         1 . A method for controlling flow of a vapor comprising:
 discharging a vapor from a vapor source into a conduit connected to the vapor source, wherein downstream of the vapor source the conduit separates into two conduits, a vapor bypass conduit and a vapor feed conduit;   providing a first vapor control valve disposed in the bypass conduit, a controller operatively connected to the first vapor control valve, a first vacuum chamber connected to the bypass conduit and disposed downstream of the first vapor control valve, and a second vacuum chamber connected to the feed conduit; and   controlling the flow of vapor passing through the bypass conduit by manipulation of the first vapor control valve.   
     
     
         2 . The method of  claim 1 , in which there is also provided in the feed conduit upstream of the second vacuum chamber a second valve and during part of carrying out of the method, vapor flow in the feed conduit is prevented by closing the second valve. 
     
     
         3 . The method of  claim 1  in which
 the second vacuum chamber comprises a vapor coater, the vapor coater comprising a temperature-controlled surface, a vapor dispensing nozzle connected to the vapor feed conduit and disposed proximate the temperature-controlled surface and a plurality of rollers configured for passing a substrate web around the a temperature-controlled surface; and 
 the method further comprises the steps of 
 discharging the vapor from the dispensing nozzle; and 
 depositing the vapor on a surface of the substrate web to form a coating. 
 
     
     
         4 . The method of  claim 3 , in which the vapor is deposited on the surface of the substrate web by one or more methods selected from the group consisting of condensation, chemical vapor deposition, and plasma deposition. 
     
     
         5 . The method of  claim 3  further comprising curing the coating. 
     
     
         6 . The method of  claim 3 , wherein the coating is deposited at a mean thickness between 0.01 and 1.0 μm. 
     
     
         7 . The method of  claim 1  in which the operating temperature and/or pressure conditions of the first and second vacuum chambers are different, and conditions in the first vacuum chamber cause one or more components of the vapor to be condensed and collected in the first vacuum chamber. 
     
     
         8 . The method of  claim 1  in which the second vacuum chamber further comprises a vacuum distillation chamber for condensing at least a portion of the vapor, the method further comprising collecting condensed vapor in a collector within the vacuum distillation chamber. 
     
     
         9 . The method of  claim 1  further comprising adding to the vapor in the conduit a gas selected from nitrogen, argon, helium, neon, oxygen, ozone, nitrous oxide, hydrogen, hydrogen sulfide, carbon tetrafluoride, methane, ammonia and combinations thereof.