Apparatus for thermoelectric recovery of electronic waste heat

Abstract

The present document describes an apparatus for recovering heat from an electronic component to generate electric energy. The apparatus comprises a thermoelectric generator having a cold side and a hot side, the hot side being in thermal communication with the electronic component. The apparatus further comprises a heat dissipation device in thermal communication with the cold side of the thermoelectric generator for dissipate heat it receives, and a heat transfer device for directly transferring the heat from the electronic component to the heat dissipation device.

1 . An apparatus for recovering heat from an electronic component to generate electric energy, the apparatus comprising:
 a thermoelectric generator having a cold side and a hot side, the hot side in thermal communication with the electronic component;   a heat dissipation device in thermal communication with the cold side of the thermoelectric generator for dissipate heat it receives; and   a heat transfer device comprising a metallic material for directly transferring the heat from the electronic component to the heat dissipation device.   
     
     
         2 . The apparatus of  claim 1 , wherein the heat dissipation device comprises a liquid cooling heat sink. 
     
     
         3 . The apparatus of  claim 1 , wherein the heat transfer device comprises a heat pipe. 
     
     
         4 . The apparatus of  claim 3 , wherein the heat pipe surrounds the thermoelectric generator at least partially. 
     
     
         5 . The apparatus of  claim 1 , wherein the heat transfer device comprises a heat conductor. 
     
     
         6 . The apparatus of  claim 5 , wherein the heat conductor surrounds the thermoelectric generator at least partially. 
     
     
         7 . The apparatus of  claim 1 , further comprising either thermal paste or thermal adhesive between the electronic component and the thermoelectric generator, and between the electronic component and the heat transfer device for enabling a sufficient heat transfer therebetween. 
     
     
         8 . The apparatus of  claim 1 , wherein the heat dissipation device comprises a heat transfer fluid for absorbing the heat from the thermoelectric generator and from the heat transfer device. 
     
     
         9 . The apparatus of  claim 8 , wherein the heat dissipation device further comprises a pipe for having the heat transfer fluid circulate therein, for improving heat transfer to the heat dissipation device. 
     
     
         10 . The apparatus of  claim 9 , wherein the heat dissipation device further comprises a heat sink in thermal communication with at least one of the pipe and the heat transfer fluid, for releasing heat from the heat transfer fluid. 
     
     
         11 . The apparatus of  claim 8 , wherein the heat dissipation device comprises a heat exchange device for completely covering the cold side of the thermoelectric generator and for covering at least partially the heat transfer device. 
     
     
         12 . The apparatus of  claim 11 , wherein the heat exchange device is in thermal communication with the heat transfer fluid, for transferring heat from the cold side of the thermoelectric generator and from the heat transfer device to the heat transfer liquid. 
     
     
         13 . The apparatus of  claim 1 , wherein the apparatus is for recovering heat from an electronic component comprising one of: a processor, a physical memory, and a chipset. 
     
     
         14 . The apparatus of  claim 1 , wherein the hot side in thermal communication with the electronic component comprises a hot side in thermal communication with a heat spreader of the electronic component. 
     
     
         15 . The apparatus of  claim 1 , wherein the thermoelectric generator is affixed on a part of a surface of the electronic component, defining a remainder of the surface of the electronic component, and wherein the heat transfer device is affixed on the remainder of the surface, thereby surrounding the thermoelectric generator at least partially. 
     
     
         16 . The apparatus of  claim 15 , wherein the thermoelectric generator and the heat transfer device substantially have the same thickness, and wherein the heat dissipation device is affixed on both the thermoelectric generator and the heat transfer device. 
     
     
         17 . A method for recovering heat from an electronic component, the method comprising:
 transferring, from the electronic component:
 a first fraction of the heat to a thermoelectric generator for heat recovery; and 
 a second fraction of the heat to the heat transfer device for increasing heat evacuation from the electronic component; and 
   actively cooling down the thermoelectric generator and the heat transfer device.   
     
     
         18 . The method of  claim 17 , wherein actively cooling down the thermoelectric generator and the heat transfer device comprises liquid-cooling the thermoelectric generator and the heat transfer device. 
     
     
         19 . The method of  claim 18 , wherein liquid-cooling comprises pumping a liquid from the thermoelectric generator and the heat transfer device at which heat is absorbed by the liquid toward a heat sink at which heat is released. 
     
     
         20 . The method of  claim 17 , further comprising, upon transferring a first fraction of the heat to a thermoelectric generator, generating electric energy.