Packaging structure and method of fabricating the same

Abstract

A package structure includes a dielectric layer having opposing first and second surfaces, a wiring layer formed on the first surface and having a plurality of conducive vias that penetrate the dielectric layer, an electronic component disposed on the first surface of the dielectric layer and electrically connected to the wiring layer, an encapsulant encapsulating the electronic component, and a packaging substrate disposed on the second surface and electrically connected to the conductive vias. With the dielectric layer in replacement of a conventional silicon board and the wiring layer as a signal transmission medium between the electronic component and the packaging substrate, the package structure does not need through-silicon vias. Therefore, the package structure has a simple fabrication process and a low fabrication cost. The present invention further provides a method of fabricating the package structure.

What is claimed is: 
     
         1 . A package structure, comprising:
 a dielectric layer having opposing first and second surfaces;   a wiring layer formed on the first surface of the dielectric layer and having a plurality of conductive vias penetrating the dielectric layer;   at least one electronic element formed on the first surface of the dielectric layer and electrically connected with the wiring layer;   an encapsulant formed on the wiring layer and the first surface of the dielectric layer, for encapsulating the electronic component; and   a packaging substrate formed on the second surface of the dielectric layer and electrically connected with the conductive vias.   
     
     
         2 . The package structure of  claim 1 , wherein the conductive vias have end surfaces flush with the second surface of the dielectric layer. 
     
     
         3 . The package structure of  claim 1 , wherein the electronic element is an active component, a passive component, or a combination thereof. 
     
     
         4 . The package structure of  claim 1 , further comprising forming on the wiring layer a plurality of first conductive elements that are coupled with the electronic element. 
     
     
         5 . The package structure of  claim 1 , further comprising forming an insulating protection layer on the first surface of the dielectric layer and the wiring layer, with a portion of the wiring layer exposed from the insulating protection layer. 
     
     
         6 . The package structure of  claim 1 , further comprising forming on the end surfaces of the conductive vias a plurality of second conductive elements that are coupled with the packaging substrate. 
     
     
         7 . The package structure of  claim 1 , further comprising forming an insulating protection layer on the second surface of the dielectric layer, with end surfaces of the conductive vias exposed from the insulating protection layer. 
     
     
         8 . The package structure of  claim 1 , wherein the dielectric layer is made of a photo imageable dielectric. 
     
     
         9 . A method of fabricating a package structure, comprising:
 forming on a carrier a dielectric layer that has a first surface and a second surface opposing the first surface and coupled to the carrier;   forming on the first surface of the dielectric layer an wiring layer that has a plurality of conductive vias formed in the dielectric layer and coupled with the second surface of the dielectric layer;   removing the carrier, with end surfaces of the conductive vias exposed from the second surface of the dielectric layer;   forming on the first surface of the dielectric layer at least one electronic element electrically connected with the wiring layer;   forming on the wiring layer and the first surface of the dielectric layer an encapsulant that encapsulates the electronic component; and   forming on the second surface of the dielectric layer a packaging substrate that is electrically connected with the conductive vias.   
     
     
         10 . The method of  claim 9 , wherein the end surfaces of the conductive vias are flush with the second surface of the dielectric layer. 
     
     
         11 . The method of  claim 9 , wherein the electronic component is an active component, a passive component, or a combination thereof. 
     
     
         12 . The method of  claim 9 , further comprising forming on the wiring layer a plurality of first conductive elements coupled to the electronic component. 
     
     
         13 . The method of  claim 9 , further comprising forming an insulating protection layer on the first surface of the dielectric layer and the wiring layer, with a portion of the wiring layer exposed from the insulating protection layer. 
     
     
         14 . The method of  claim 9 , further comprising forming on the end surfaces of the conductive vias second conductive elements that are coupled to the packaging substrate. 
     
     
         15 . The method of  claim 9 , further comprising forming an insulating protection layer on the second surface of the dielectric layer and on the end surfaces of the conductive vias, with the end surfaces of the conductive vias exposed from the insulating protection layer. 
     
     
         16 . The method of  claim 9 , wherein the carrier is a glass board. 
     
     
         17 . The method of  claim 9 , wherein the dielectric layer is made of a photo imageable dielectric.