Methods of forming an article using electrophoretic deposition, and related article

Abstract

In one example of the present technology, a method for forming an article includes disposing an electrically conductive coating on a substrate. The method further includes disposing a layer stack on the electrically conductive coating by (i) disposing a first barrier coating by electrophoretic deposition; (ii) heat treating the first barrier coating; (iii) disposing an electrically conductive layer on the first barrier coating; and (iv) optionally repeating steps (i) to (iii). The method further includes disposing a second barrier coating on an outermost electrically conductive layer in the layer stack by electrophoretic deposition; and heat treating the second barrier coating.

What is claimed is: 
     
         1 . A method for forming an article, comprising:
 (a) disposing an electrically conductive coating on a substrate;   (b) disposing a layer stack on the electrically conductive coating by:
 (i) disposing a first barrier coating by electrophoretic deposition; 
 (ii) heat treating the first barrier coating; 
 (iii) disposing an electrically conductive layer on the first barrier coating; and 
 (iv) optionally repeating steps (i) to (iii); 
   (c) disposing a second barrier coating on an outermost electrically conductive layer in the layer stack by electrophoretic deposition; and   (d) heat treating the second barrier coating.   
     
     
         2 . The method of  claim 1 , wherein the first barrier coating and the second barrier coating undergo at least partial densification during the heat treatment steps. 
     
     
         3 . The method of  claim 1 , wherein the electrically conductive layer is disposed by electroless plating, spraying, dip coating, physical vapor deposition, chemical vapor deposition, or combinations thereof. 
     
     
         4 . The method of  claim 1 , wherein the electrically conductive layer comprises a metal, an intermetallic, a metalloid, carbon, a conductive polymer, or combinations thereof. 
     
     
         5 . The method of  claim 4 , wherein the electrically conductive layer comprises gold, silver, nickel, a conductive polymer, carbon, palladium, platinum, copper, iron, cobalt, boron, or combinations thereof. 
     
     
         6 . The method of  claim 4 , wherein the electrically conductive layer comprises electroless-plated gold platinum, palladium, copper, nickel, cobalt, iron, boron, or combinations thereof. 
     
     
         7 . The method of  claim 1 , wherein the first barrier coating comprises a rare earth silicate. 
     
     
         8 . The method of  claim 7 , wherein the first barrier coating comprises a rare earth disilicate selected from the group consisting of ytterbium disilicate, yttrium disilicate, and combinations thereof. 
     
     
         9 . The method of  claim 1 , wherein the second barrier coating comprises a rare earth silicate. 
     
     
         10 . The method of  claim 9 , wherein the second barrier coating comprises a rare earth monosilicate selected from the group consisting of yttrium monosilicate, ytterbium monosilicate, and combinations thereof. 
     
     
         11 . The method of  claim 1 , wherein the electrically conductive coating disposed on the substrate comprises silicon, metal silicide, silicon carbide, or combinations thereof. 
     
     
         12 . The method of  claim 1 , wherein the electrically conductive coating disposed on the substrate further functions as a bond coating between the substrate and the first barrier coating. 
     
     
         13 . An article formed by the method of  claim 1 . 
     
     
         14 . A turbine engine component comprising the article of  claim 13 . 
     
     
         15 . A method for forming an article, comprising:
 (a) disposing an electrically conductive coating on a substrate;   (b) disposing a layer stack on the electrically conductive coating by:
 (i) disposing a first barrier coating by electrophoretic deposition, wherein the first barrier coating comprises a rare earth disilicate; 
 (ii) heat treating the first barrier coating; 
 (iii) disposing an electrically conductive layer on the first barrier coating; and 
 (iv) optionally repeating steps (i) to (iii); 
   (c) disposing a second barrier coating on an outermost electrically conductive layer in the layer stack by electrophoretic deposition, wherein the second barrier coating comprises a rare earth monosilicate; and   (d) heat treating the second barrier coating.   
     
     
         16 . The method of  claim 15 , wherein the first barrier coating and the second barrier coating undergo at least partial densification during the heat treatment steps. 
     
     
         17 . The method of  claim 15 , wherein the electrically conductive layer is disposed by electroless plating, spraying, dip coating, physical vapor deposition, chemical vapor deposition, or combinations thereof. 
     
     
         18 . The method of  claim 15 , wherein the electrically conductive layer comprises a metal, an intermetallic, a metalloid, carbon, a conductive polymer, or combinations thereof. 
     
     
         19 . The method of  claim 18 , wherein the electrically conductive layer comprises gold, silver, nickel, a conductive polymer, carbon, palladium, platinum, copper, iron, cobalt, boron, or combinations thereof. 
     
     
         20 . The method of  claim 15 , wherein the electrically conductive coating comprises silicon, metal silicide, silicon carbide, or combinations thereof.