US2016153468A1PendingUtilityA1
Thin fan and manufacturing method thereof
Est. expiryDec 19, 2031(~5.4 yrs left)· nominal 20-yr term from priority
F04D 29/424F04D 25/0633H05K 3/182H05K 3/341F04D 29/624H05K 2201/0999H05K 2201/0215Y10T29/49316F04D 25/0606H05K 3/105F04D 29/646F04D 25/0693Y02P70/50
55
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Claims
Abstract
A manufacturing method of a thin fan comprises the steps of: providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A manufacturing method of a thin fan, comprising the steps of:
providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area.
2 . The manufacturing method of claim 1 , wherein the plastic material comprises polyphthalamide (PPA) and/or liquid crystalline polymer (LCP), and the metal particles comprise copper particles and/or chromium particles.
3 . The manufacturing method of claim 1 , wherein the step of removing a part of a surface of the housing comprises roughening the surface so as to expose the metal particles therein.
4 . The manufacturing method of claim 1 , wherein the step of removing a part of a surface of the housing comprises illuminating the surface by laser.
5 . The manufacturing method of claim 1 , wherein the step of forming a metal layer in the circuit layout area comprises forming the metal layer by chemical plating.
6 . The manufacturing method of claim 1 , further comprising:
disposing at least one electronic device on the metal layer; and assembling the housing, a stator, and an impeller.
7 . The manufacturing method of claim 1 , wherein the step of disposing at least one electronic device on the metal layer comprises disposing the electronic device on the metal layer by soldering.
8 . A manufacturing method of a thin fan, comprising steps of:
providing a first plastic material containing a plurality of metal particles; molding the first plastic material into a circuit layout portion; providing a second plastic material without metal particles; molding the second plastic material into a housing portion connected to the circuit layout portion to form a housing; removing a part of a surface of the circuit layout portion to form a circuit layout area; and forming a metal layer in the circuit layout area.
9 . The manufacturing method of claim 8 , wherein the step of removing a part of a surface of the circuit layout portion comprises roughening the surface so as to expose the metal particles therein.
10 . The manufacturing method of claim 8 , wherein the step of forming a metal layer in the circuit layout area comprises forming the metal layer by chemical plating.
11 . The manufacturing method of claim 8 , further comprising:
disposing at least one electronic device on the metal layer.Join the waitlist — get patent alerts
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