US2016148960A1PendingUtilityA1

Solid-state imaging device

Assignee: TOSHIBA KKPriority: Feb 26, 2013Filed: Nov 19, 2015Published: May 26, 2016
Est. expiryFeb 26, 2033(~6.6 yrs left)· nominal 20-yr term from priority
Inventors:Yoshitaka Egawa
H04N 25/72H10F 39/8057H10F 39/8037H10F 39/813H10F 39/199H10F 39/80H10F 39/18H10F 39/15H10F 39/802H10F 39/12H01L 27/14612H01L 27/14641H01L 27/14603H01L 27/14643H01L 27/1464H01L 27/14623H04N 25/77
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Claims

Abstract

According to one embodiment, a photoelectric converting layer, a charge accumulating layer, and a light collecting unit are provided. The photoelectric converting layer is formed at a back surface side of a semiconductor substrate. The charge accumulating layer is formed at a front surface side of the semiconductor substrate, and accumulates charges photoelectric-converted by the photoelectric converting layer. The light collecting unit makes light incident to the back surface side of the semiconductor substrate to be collected on the photoelectric converting layer not to be incident to the charge accumulating layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A solid-state imaging device, comprising:
 a photoelectric converting layer that is formed at a back surface side of a semiconductor substrate, and photoelectric-converts and accumulates charges;   a reading unit that is formed at a front surface side of the semiconductor substrate, and reads out the accumulated charges by the photoelectric converting layer;   a charge accumulating layer that is formed at the front surface side of the semiconductor substrate, and accumulates charges read out by the reading unit;   a light blocking layer that blocks light incident to the back surface side of the semiconductor substrate from being incident to the charge accumulating layer;   a transparent layer formed on the light blocking layer; and   a light collecting unit that is formed on the transparent layer, and makes light incident to the back surface side of the semiconductor substrate to be collected on the photoelectric converting layer.   
     
     
         2 . The solid-state imaging device according to  claim 1 ,
 wherein the photoelectric converting layer is arranged to at least partially overlap the charge accumulating layer.   
     
     
         3 . The solid-state imaging device according to  claim 1 ,
 wherein charge accumulation operations of the photoelectric converting layers of all pixels are simultaneously started, and charges are simultaneously read out from the photoelectric converting layers of all pixels to the charge accumulating layer.   
     
     
         4 . The solid-state imaging device according to  claim 1 , further comprising:
 a global reset transistor that simultaneously resets the photoelectric converting layers of all pixels;   a global read transistor that simultaneously transfers charges from the photoelectric converting layers of all pixels to the charge accumulating layer;   a read transistor that reads out the charges transferred to the charge accumulating layer to a floating diffusion of each pixel;   a detecting transistor that detects the charges read out to the floating diffusion; and   a reset transistor that resets the floating diffusion.

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