US2016148908A1PendingUtilityA1
Multi-chip package system
Est. expiryApr 11, 2033(~6.7 yrs left)· nominal 20-yr term from priority
Inventors:Chun-Seok Jeong
H10W 90/00G11C 8/12G11C 29/028G11C 7/20G11C 5/063G11C 29/025G11C 2207/105H10D 89/00H01L 25/0657G11C 7/10G11C 5/02
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Claims
Abstract
A multi-chip package system includes a signal transmission line commonly coupled to a plurality of semiconductor chips to transfer data to/from the semiconductor chips from/to outside; and a termination controller suitable for detecting a loading value of the signal transmission line and controlling a termination operation on the signal transmission line based on the loading value.
Claims
exact text as granted — not AI-modified1 - 4 . (canceled)
5 . A multi-chip package system comprising:
a controller suitable for generating an enable signal for controlling an enable operation for a plurality of semiconductor chips; a switching block suitable for coupling a signal transmission line to a number of semiconductor chips, wherein the number of semiconductor chips to be coupled is determined in response to the enable signal; and a termination controller suitable for controlling a termination operation on the signal transmission line in response to the enable signal.
6 . The multi-chip package system of claim 5 , wherein the termination controller performs the termination operation in response to an enable signal for a predetermined semiconductor chip among the plurality of semiconductor chips.
7 . The multi-chip package system of claim 5 , wherein the termination controller comprises:
a detection unit suitable for detecting whether the enable signal is activated or not and to output a detection signal; and an operation unit suitable for performing the termination operation on the one transmission line in response to the detection signal.
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