Method and Apparatus for Cooling Semiconductor Device Hot Blocks and Large Scale Integrated Circuit (IC) Using Integrated Interposer for IC Packages

Abstract

A method, system, and apparatus for improved IC device packaging is described. In an aspect, an (IC) device package includes an IC die having at one or more contact pads, each contact pad located at a corresponding hotspot on a surface of th28e IC die. The package also includes a thermally conductive interposer which is thermally coupled to the IC die at the contact pads. In another aspect, an underfill material fills a space between the IC die and the interposer. The interposer may also be electrically coupled to the IC die. In an aspect, the interposer and the IC die are coupled through thermal interconnects or “nodules.”

What is claimed is: 
     
         1 . A integrated circuit (IC) device package, comprising:
 an IC die having a contact pad, wherein the contact pad is located on a surface of the IC die at a hotspot of the IC die; and   a thermally conductive interposer having first and second surfaces, wherein the first surface of the interposer is thermally coupled to the IC die at the contact pad.   
     
     
         2 . The package of  claim 1 , further comprising:
 a thermal interconnect coupled between the first surface of the interposer and the contact pad.   
     
     
         3 . The package of  claim 1 , further comprising:
 an underfill material that substantially fills a space between the surface of the IC die and the first surface of the interposer.   
     
     
         4 . The package of  claim 1 , wherein the first surface of the interposer has at least one post. 
     
     
         5 . The package of  claim 1 , wherein the interposer is electrically conductive. 
     
     
         6 . The package of  claim 1 , wherein the first surface of the interposer is electrically coupled to the contact pad. 
     
     
         7 . The package of  claim 1 , further comprising:
 at least one thermally conductive nodule, wherein the first surface of the interposer is coupled to the IC die through the at least one nodule.   
     
     
         8 . The package of  claim 7 , wherein the at least one nodule is electrically conductive. 
     
     
         9 . The package of  claim 1 , wherein the package is a die-down IC device package. 
     
     
         10 . The package of  claim 1 , wherein the package is a die-up IC device package. 
     
     
         11 . The package of  claim 1 , further comprising:
 a heat spreader, wherein the heat spreader is attached to the second surface of the interposer.   
     
     
         12 . The package of  claim 11 , wherein the heat spreader is electrically coupled to the second surface of the interposer. 
     
     
         13 . The package of  claim 1  further comprising:
 a heat slug, wherein the heat slug is attached to the second surface of the interposer. 
 
     
     
         14 . The package of  claim 13 , wherein the heat slug is electrically coupled to the second surface of the interposer. 
     
     
         15 . The package of  claim 13 , wherein the heat slug is configured to be coupled to a printed circuit board (PCB). 
     
     
         16 . The package of  claim 1 , wherein the second surface of the interposer is configured to be coupled to a printed circuit board (PCB). 
     
     
         17 . The package of  claim 1 , wherein the surface of the die has a second contact pad configured for attachment by a wirebond. 
     
     
         18 . The package of  claim 17 , wherein the first contact pad is centrally located on the surface of the die, and the second contact pad is located in a peripheral region of the surface of the die. 
     
     
         19 . The package of  claim 2 , further comprising:
 at least one additional thermal interconnect;   wherein the surface of the die includes at least one additional contact pad located in at least one hotspot of the IC die, wherein each additional thermal interconnect is coupled between a corresponding additional contact pad and the first surface of the interposer.   
     
     
         20 . The package of  claim 2 , wherein the thermal interconnect is a solder ball. 
     
     
         21 . The package of  claim 2 , wherein the thermal interconnect is a block. 
     
     
         22 . The package of  claim 2 , wherein the thermal interconnect is a solder bump. 
     
     
         23 . A method of assembling an integrated circuit (IC) package, comprising:
 coupling a first surface of an interposer to a contact pad on a surface of an IC die through at least one nodule.   
     
     
         24 . The method of  claim 23 , further comprising:
 bumping the first surface of the interposer with the nodule, wherein a location of the nodule on the first surface corresponds to a location of the contact pad on the surface of the IC die.   
     
     
         25 . The method of  claim 23 , further comprising:
 bumping the contact pad on the first surface of the IC die with the nodule.   
     
     
         26 . The method of  claim 23 , wherein said coupling step comprises:
 electrically coupling the first surface of the interposer to the IC die through the at least one nodule.   
     
     
         27 . The method of  claim 23 , further comprising:
 filling a space between the surface of the IC die and the first surface of the interposer with an underfill material.   
     
     
         28 . The method of  claim 23 , further comprising:
 attaching a second surface of the interposer to a heat slug, heat spreader, another interposer, heat sink, solder balls, or printed wire board (PWB).