Method for fabrication of anisotropic conductive member and method for fabrication of anisotropic conductive bonding package

Abstract

Provided is a method for fabrication of an anisotropic conductive member, the method including a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.

What is claimed is: 
     
         1 . A method for fabrication of an anisotropic conductive member, the method comprising:
 a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.   
     
     
         2 . The method for fabrication of an anisotropic conductive member according to  claim 1 , wherein the residual stress relaxation step includes a step of baking the insulating matrix. 
     
     
         3 . The method for fabrication of an anisotropic conductive member according to  claim 2 , wherein the residual stress relaxation step is a step of baking the insulating matrix while applying a load to at least one of one surface and the other surface of the insulating matrix. 
     
     
         4 . The method for fabrication of an anisotropic conductive member according to  claim 3 , wherein the load for the residual stress relaxation step is applied at a pressure of 50 g/cm 2  to 2,000 g/cm 2 . 
     
     
         5 . The method for fabrication of an anisotropic conductive member according to  claim 2 , wherein the baking in the residual stress relaxation step is carried out at a temperature of 50° C. to 600° C. 
     
     
         6 . The method for fabrication of an anisotropic conductive member according to  claim 3 , wherein the baking in the residual stress relaxation step is carried out at a temperature of 50° C. to 600° C. 
     
     
         7 . The method for fabrication of an anisotropic conductive member according to  claim 4 , wherein the baking in the residual stress relaxation step is carried out at a temperature of 50° C. to 600° C. 
     
     
         8 . The method for fabrication of an anisotropic conductive member according to  claim 2 , wherein the baking in the residual stress relaxation step is carried out in a vacuum, in a nitrogen atmosphere, or in an argon atmosphere. 
     
     
         9 . The method for fabrication of an anisotropic conductive member according to  claim 3 , wherein the baking in the residual stress relaxation step is carried out in a vacuum, in a nitrogen atmosphere, or in an argon atmosphere. 
     
     
         10 . The method for fabrication of an anisotropic conductive member according to  claim 4 , wherein the baking in the residual stress relaxation step is carried out in a vacuum, in a nitrogen atmosphere, or in an argon atmosphere. 
     
     
         11 . The method for fabrication of an anisotropic conductive member according to  claim 5 , wherein the baking in the residual stress relaxation step is carried out in a vacuum, in a nitrogen atmosphere, or in an argon atmosphere. 
     
     
         12 . The method for fabrication of an anisotropic conductive member according to  claim 6 , wherein the baking in the residual stress relaxation step is carried out in a vacuum, in a nitrogen atmosphere, or in an argon atmosphere. 
     
     
         13 . The method for fabrication of an anisotropic conductive member according to  claim 1 , wherein the residual stress relaxation step is a step of applying ultrasonic vibration to the insulating matrix while immersing the insulating matrix in a liquid. 
     
     
         14 . The method for fabrication of an anisotropic conductive member according to  claim 13 , wherein the residual stress relaxation step is a step of applying the ultrasonic vibration at a frequency of 20 kHz to 100 kHz. 
     
     
         15 . The method for fabrication of an anisotropic conductive member according to  claim 13 , wherein the residual stress relaxation step is a step of applying the ultrasonic vibration for 10 minutes or longer. 
     
     
         16 . The method for fabrication of an anisotropic conductive member according to  claim 14 , wherein the residual stress relaxation step is a step of applying the ultrasonic vibration for 10 minutes or longer. 
     
     
         17 . A method for fabrication of an anisotropic conductive bonding package, the method comprising:
 a connection unit forming step of applying a conductive material on the anisotropic conductive member obtained by the method for fabrication of an anisotropic conductive member according to  claim 1 , and thereby obtaining an anisotropic conductive bonding package having a connection unit that is connected to at least one of the plural conductive paths.   
     
     
         18 . A method for fabrication of an anisotropic conductive bonding package, the method comprising:
 a connection unit forming step of applying a conductive material on the anisotropic conductive member obtained by the method for fabrication of an anisotropic conductive member according to  claim 12 , and thereby obtaining an anisotropic conductive bonding package having a connection unit that is connected to at least one of the plural conductive paths.   
     
     
         19 . A method for fabrication of an anisotropic conductive bonding package, the method comprising:
 a connection unit forming step of applying a conductive material on the anisotropic conductive member obtained by the method for fabrication of an anisotropic conductive member according to  claim 16 , and thereby obtaining an anisotropic conductive bonding package having a connection unit that is connected to at least one of the plural conductive paths.