US2016133774A1PendingUtilityA1
Solar cell with dielectric back reflective coating
Est. expiryMar 3, 2030(~3.6 yrs left)· nominal 20-yr term from priority
Y02E10/50Y02E10/52Y02E10/547H10F 71/00H10F 77/707H10F 77/315H10F 77/311H10F 77/211H10F 77/48H10F 71/128H10F 71/121H10F 10/14H10F 77/488H01L 31/0547Y02P70/50
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Claims
Abstract
In a method for producing a solar cell, a layer stack of dielectric layers is applied to a back of a solar cell substrate and the layer stack is heated and is held at temperatures of at least 700° C. during a time period of at least 5 minutes. The novel solar cell has a layer stack of dielectric layers on its back. At least one of the dielectric layers of the layer stack is densified so that its resistivity to firing-through of pastes with glass components is enhanced.
Claims
exact text as granted — not AI-modified1 . A solar cell, comprising:
a layer stack of a plurality of dielectric layers disposed on a back of the solar cell; at least one of said dielectric layers of said layer stack being a densified layer having an enhanced resistivity to firing through of pastes with glass components as compared with a resistivity of the respective layer at a time immediately after a deposition thereof.
2 . The solar cell according to claim 1 , wherein said layer stack includes a silicon oxide layer with a thickness of less than 100 nm.
3 . The solar cell according to claim 2 , wherein the thickness of said silicon oxide layer is between 5 nm and 100 nm.
4 . The solar cell according to claim 3 , wherein the thickness of said silicon oxide layer is between 10 nm and 100 nm.
5 . The solar cell according to claim 1 , wherein said layer stack includes a silicon nitride layer having a thickness of less than 200 nm.
6 . The solar cell according to claim 5 , wherein the thickness of said silicon nitride layer is between 50 nm and 200 nm.
7 . The solar cell according to claim 5 , wherein the thickness of said silicon nitride layer is between 70 nm and 150 nm.
8 . The solar cell according to claim 1 , wherein said layer stack includes a silicon oxide layer and a silicon nitride layer, with said silicon nitride layer being arranged on top of said silicon oxide layer.Join the waitlist — get patent alerts
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