Multilayer pads and methods of manufacture employing thermal bonding
Abstract
In-line methods for manufacturing a plurality of multilayer pads and the resultant pads. Various embodiments of the invention employ one or two thermal bonding stations, such as ultrasonic bonding stations, along with handle folding tooling, to produce two- or three-layer pads in various configurations, without the use of adhesive. Following bonding and handle folding, a cutter, such as a die cutter, is employed to cut through the layers to form individual pads. Pads of various configurations are manufactured, including pads with “L”-shaped handles, handles of “wing” configuration, and “folded” handles.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A multilayer pad comprising:
an absorbent base pad layer having an applying/wiping surface, an attachment surface opposite said applying/wiping surface, and an outer periphery; a barrier layer having a lower surface attached by fusing to said base pad layer attachment surface, an upper surface, and an outer periphery coextensive with said outer periphery of said base pad layer; a handle including an attached portion fused to a portion of said barrier layer upper surface, and including at least one graspable free portion joined to said handle attached portion along a fold line defining an axis of said multilayer pad; and said handle attached portion being attached to said barrier layer upper surface along bond lines parallel to the pad axis, a major portion of said handle attached portion not being attached to said barrier layer.
2 . The multilayer pad of claim 1 , wherein said handle attached portion is attached to said barrier layer upper surface at least by a bond line adjacent the fold line.
3 . The multilayer pad of claim 1 , wherein
said handle has a pair of attached portions, including said handle attached portion, and an intermediate graspable portion in the form of a fold; and wherein each of said handle attached portions is attached to said barrier layer upper surface at least by a bond line adjacent the fold line.
4 . A multilayer pad comprising:
an absorbent base pad layer having an applying/wiping surface, an attachment surface opposite said applying/wiping surface, and an outer periphery; a barrier layer having a lower surface attached by fusing to said base pad layer attachment surface, an upper surface, and an outer periphery coextensive with said outer periphery of said base pad layer; a handle including an attached portion fused to a portion of said barrier layer upper surface, and including at least one graspable free portion joined to said handle attached portion along a fold line defining an axis of said multilayer pad; and said handle attached portion being attached to said barrier layer upper surface and said barrier layer lower surface being attached to said base pad layer attachment surface along bond lines parallel to the pad axis, a major portion of said handle attached portion not being attached to said barrier layer.
5 . The multilayer pad of claim 4 , wherein said handle attached portion is attached to said barrier layer upper surface at least by a bond line adjacent the fold line.
6 . The multilayer pad of claim 4 , wherein
said handle has a pair of attached portions, including said handle attached portion, and an intermediate graspable portion in the form of a fold; and wherein each of said handle attached portions is attached to said barrier layer upper surface at least by a bond line adjacent the fold line.
7 . A multilayer pad comprising:
an absorbent base pad layer having an applying/wiping surface, an attachment surface opposite said applying/wiping surface, and an outer periphery; a barrier layer having a lower surface attached by fusing to said base pad layer attachment surface, an upper surface, and an outer periphery coextensive with said outer periphery of said base pad layer; a handle including at least one attached portion fused to a portion of said barrier layer upper surface, and including at least one graspable free portion joined to said handle attached portion along a fold line defining an axis of said multilayer pad; said barrier layer being continuously fused to said base pad layer; and said handle attached portion being attached to said barrier layer upper surface along a bond line parallel to the pad axis, a major portion of said handle attached portion not being attached to said barrier layer.
8 . The multilayer pad of claim 7 , wherein said handle attached portion is attached to said barrier layer upper surface at least by a bond line adjacent the fold line.
9 . The multilayer pad of claim 7 , wherein
said handle has a pair of attached portions, including said at least one handle attached portion, and an intermediate graspable portion in the form of a fold; and wherein each of said handle attached portions is attached to said barrier layer upper surface at least by a bond line adjacent the fold line.Join the waitlist — get patent alerts
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