US2016126315A1PendingUtilityA1

III-Nitride Semiconductor Structure with Intermediate and Transition Layers

Assignee: INFINEON TECHNOLOGIES AMERICAS CORPPriority: Dec 14, 2000Filed: Oct 29, 2015Published: May 5, 2016
Est. expiryDec 14, 2020(expired)· nominal 20-yr term from priority
H10P 14/3458H10P 14/3416H10P 14/3254H10P 14/3252H10P 14/3216H10P 14/3211H10P 14/2926H10P 14/2925H10P 14/2922H10P 14/2905H10P 14/24C30B 23/02C30B 29/403C30B 29/406C30B 25/183C30B 29/06Y10T428/265Y10T428/24942C30B 25/02C30B 25/18Y10T428/26C30B 23/025C30B 29/68H10D 62/8503H10D 62/852H10D 62/826H10D 62/824H10D 62/405H10D 62/115H10D 62/40H10D 30/4755H10D 30/60H10D 30/015H10H 20/01335H10H 20/825H10H 20/815H10H 20/812H10H 20/811H10H 20/0137H10H 20/0133H10D 30/475H10D 62/8164H01L 29/205H01L 21/0254H01L 21/0251H01L 29/2003H01L 21/02458H01L 21/02507H01L 29/155
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Claims

Abstract

The invention provides semiconductor materials including a gallium nitride material layer formed on a silicon substrate and methods to form the semiconductor materials. The semiconductor materials include a transition layer formed between the silicon substrate and the gallium nitride material layer. The transition layer is compositionally-graded to lower stresses in the gallium nitride material layer which can result from differences in thermal expansion rates between the gallium nitride material and the substrate. The lowering of stresses in the gallium nitride material layer reduces the tendency of cracks to form. Thus, the invention enables the production of semiconductor materials including gallium nitride material layers having few or no cracks. The semiconductor materials may be used in a number of microelectronic and optical applications.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 - 92 . (canceled) 
     
     
         93 . A semiconductor structure comprising:
 a substrate;   an intermediate layer over the substrate, wherein the intermediate layer comprises aluminum nitride, an aluminum nitride alloy, or a gallium nitride alloy;   a transition layer over the intermediate layer, wherein the transition layer comprises two or more Al x In y Ga (1-x-y) N layers with different Al x In y Ga (1-x-y) N compositions, wherein 0≦x≦1 and 0≦y≦1;   a gallium nitride layer over the transition layer.   
     
     
         94 . The semiconductor structure of  claim 93 , wherein the substrate comprises a silicon substrate, a silicon-on-insulator substrate, a silicon-on-sapphire substrate, or a SIMOX substrate. 
     
     
         95 . The semiconductor structure of  claim 93 , wherein the two or more Al x In y Ga (1-x-y N layers comprise at least one aluminum nitride layer. 
     
     
         96 . The semiconductor structure of  claim 93 , wherein the two or more Al x In y Ga (1-x-y) N layers comprise at least one layer that is substantially free of gallium. 
     
     
         97 . The semiconductor structure of  claim 93 , wherein the transition layer comprises two or more layers of gallium nitride alloy and two or more aluminum nitride layers. 
     
     
         98 . The semiconductor structure of  claim 93 , wherein the transition layer is discontinuously graded. 
     
     
         99 . The semiconductor structure of  claim 93 , wherein y=0 and the x value of the two or more Al x In y Ga (1-x-y) N layers is varied across the transition layer. 
     
     
         100 . The semiconductor structure of  claim 99 , wherein the x value of the two or more Al x In y Ga (1-x-y) N layers is varied discontinuously across the transition layer. 
     
     
         101 . The semiconductor structure of  claim 93 , further comprising a superlattice layer over the substrate. 
     
     
         102 . The semiconductor structure of  claim 98 , wherein the superlattice layer is formed between the substrate and the gallium nitride layer.

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