Refrigeration device with a heat circulation system

Abstract

A refrigeration device has a heat source and a heat circulation system for heating an opening area of a frame. The heat circulation system contains a heat transport substance, and the heat circulation system contains a heat take-up area and a frame heating area. The heat source is embodied to emit a quantity of heat through the heat take-up area to the heat transport substance in the heat circulation system, in order to obtain a heated-up heat transport substance. The heat circulation system is embodied to convey the heated heat transport substance from the heat take-up area to the frame heating. The frame heating is embodied to emit the quantity of heat taken up by the heat transport substance to the opening area of the frame of the refrigeration device.

1 . A refrigeration device, comprising:
 a frame having an opening area;   a heat source;   a heat circulation system for heating said opening area of said frame, said heat circulation system including a heat transport substance and having a heat take-up area and a frame heating area;   said heat source configured to emit a quantity of heat through said heat take-up area to the heat transport substance in said heat circulation system to obtain a heated heat transport substance;   said heat circulation system configured to convey the heated heat transport substance from said heat take-up area to said frame heating area; and   said frame heating area embodied to emit the quantity of the heat taken up by the heat transport substance to said opening area of said frame.   
     
     
         2 . The refrigeration device according to  claim 1 , wherein said heat circulation system contains a thermosiphon or a heat pipe. 
     
     
         3 . The refrigeration device according to  claim 1 , wherein said heat source contains a compressor or a condenser. 
     
     
         4 . The refrigeration device according to  claim 3 , wherein said heat source contains said condenser made from multi-port extruded piping. 
     
     
         5 . The refrigeration device according to  claim 4 , wherein said condenser made from said multi-port extruded piping has a plurality of channels which are each separated from one another by webs. 
     
     
         6 . The refrigeration device according to  claim 1 , wherein the heat transport substance contains an alkane or a fluorinated hydrocarbon. 
     
     
         7 . The refrigeration device according to  claim 1 , wherein the heat transport substance in said heat take-up area, before taking up the quantity of heat, has a fluid aggregate state, and that the heat transport substance in said frame heating area, before emitting the quantity of heat, has a gaseous aggregate state. 
     
     
         8 . The refrigeration device according to  claim 1 , further comprising an area of insulation, said heat take-up area and said frame heating area of said heat circulation system are separated by said area of insulation. 
     
     
         9 . The refrigeration device according to  claim 8 , wherein said area of insulation contains an area with an insulation material which is selected from the group consisting of styrofoam, mineral wool and plastic foam. 
     
     
         10 . The refrigeration device according to  claim 1 , wherein said frame heating area is in thermally-conductive contact with said opening area of said frame in order to guarantee an effective emission of the quantity of heat to said opening area of said frame. 
     
     
         11 . The refrigeration device according to  claim 1 , wherein said frame heating area has a surface which contains more than 60% of a surface of said opening area of said frame. 
     
     
         12 . The refrigeration device according to  claim 1 , wherein said heat source contains a heat source surface, and that said heat take-up area contains a heat take-up surface which is disposed in parallel to said heat source surface, in order to guarantee an effective take-up of the quantity of heat by said heat take-up area. 
     
     
         13 . The refrigeration device according to  claim 1 , further comprising a thermally-conductive element, said heat source is connected to said heat take-up area by said thermally-conductive element, in order to guarantee an effective take-up of the quantity of heat by said heat take-up area. 
     
     
         14 . The refrigeration device according to  claim 13 , wherein said thermally-conductive element contains a thermally-conductive material, which is selected from the group consisting of silver, copper, iron and glass. 
     
     
         15 . The refrigeration device according to  claim 1 , wherein said heat circulation system includes a filler nozzle for filling said heat circulation system with the heat transport substance. 
     
     
         16 . The refrigeration device according to  claim 1 , wherein the heat transport substance contains tetrafluorethane, isobutane or water. 
     
     
         17 . The refrigeration device according to  claim 1 , wherein said frame heating area has a surface which contains more than 80% of a surface of said opening area of said frame.