Method for varnishing plated parts

Abstract

A method is provided for plating a non-metal substrate (S), allowing a plated part to be obtained. The method includes steps of: (a) providing a non-metal substrate (S) having a surface ( 11 ); (b) forming a bonding layer (C 1 ) on the surface ( 11 ); (c) forming at least one reinforcement layer (C 2 ) on the bonding layer (C 1 ); (d) forming a varnish layer (C 4 ) above the reinforcement layer (C 2 ); and performing a drying step to dry the varnish layer, wherein the varnish layer is exposed to ultraviolet radiation.

1 . A method for the plating of a non-metal substrate allowing a chromium-free plated part to be obtained, wherein:
 a non-metal substrate is provided having a surface;   a bonding layer is formed on said surface;   at least one reinforcement layer is formed on the bonding layer;   at least one varnish layer is formed above the reinforcement layer;   a drying step is also performed to dry the varnish layer at which the varnish layer is exposed to ultraviolet radiation.   
     
     
         2 . The method according to  claim 1 , wherein at least one nickel layer is formed on the reinforcement layer and wherein said at least one varnish layer is formed on the nickel layer. 
     
     
         3 . The method according to  claim 1 , wherein the drying step is conducted at a temperature lower than 60° C. 
     
     
         4 . The method according to  claim 1 , wherein the varnish layer is transparent or coloured. 
     
     
         5 . The method according to  claim 1 , wherein the varnish layer is an electrolytic varnish layer. 
     
     
         6 . The method according to  claim 1 , wherein the non-metal substrate consists of acrylonitrile butadiene styrene. 
     
     
         7 . The method according to  claim 1 , wherein the non-metal substrate consists of a polyamide or polypropylene. 
     
     
         8 . The method according to  claim 1 , wherein the bonding layer is obtained by successively performing chemical attack of the surface, activating the chemically attacked surface and depositing a first layer of nickel or copper on the activated surface. 
     
     
         9 . The method according to  claim 1 , wherein the reinforcement layer comprises at least one copper layer. 
     
     
         10 . The method according to  claim 2 , wherein the nickel layer comprises a microporous or micro-fissured nickel layer. 
     
     
         11 . A plated part able to be obtained by implementing the method according to  claim 1 . 
     
     
         12 . A plated part according to  claim 11 , wherein it is free of chromium and successively comprises a non-metal substrate having a surface, a first layer consisting of copper or nickel arranged on the surface, a copper layer arranged on the first layer, at least one second layer of nickel arranged on the copper layer and a varnish layer arranged on the second nickel layer. 
     
     
         13 . A method to modify a plated part wherein:
 a plated, part is provided comprising a non-metal substrate successively having a bonding layer, a reinforcement layer, a nickel layer and a chromium layer;   the chromium layer is removed and a varnish layer is deposited on the nickel layer.   
     
     
         14 . The method according to  claim 13 , wherein the nickel layer comprises a microporous or micro-fissured nickel layer. 
     
     
         15 . The method according to  claim 13 , wherein the bonding layer is a nickel layer. 
     
     
         16 . The method according to  claim 13 , wherein the reinforcement layer is a copper layer.