Method of forming diamond conditioners for cmp process

Abstract

A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process.

What is claimed is: 
     
         1 . A conditioner disk used in a chemical mechanical process (CMP), comprising:
 a substrate;   a first binder layer comprising at least one first binder disposed over the substrate;   a plurality of diamond particles disposed on the first binder layer at a plurality of locations; and   a second layer of at least one second binder over the substrate,   wherein   at least one top portion of each of the plurality of diamond particles protrudes out of the second layer of at least one second binder and is exposed, and   the plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk contacts a flat surface.   
     
     
         2 . The conditioner disk of  claim 1 , wherein the at least one first binder is a metal or metal alloy. 
     
     
         3 . The conditioner disk of  claim 1 , wherein the at least one first binder comprises a metal selected from the group consisting of nickel, titanium, iron and chromium. 
     
     
         4 . The conditioner disk of  claim 1 , wherein the at least one first binder is a material comprising a thermosetting polymer. 
     
     
         5 . The conditioner disk of  claim 1 , wherein a material of the at least one second binder layer is the same as the at least one first binder. 
     
     
         6 . The conditioner disk of  claim 1 , wherein the plurality of diamond particles are of substantially the same particle size. 
     
     
         7 . The conditioner disk of  claim 1 , wherein the plurality of diamond particles are oriented in substantially the same direction as each other. 
     
     
         8 . The conditioner disk of  claim 1 , wherein the first binder layer is disposed over the substrate in a regular pattern. 
     
     
         9 . The conditioner disk of  claim 1 , wherein the plurality of diamond particles are uniformly disposed onto portions of the first binder layer. 
     
     
         10 . The conditioner disk of  claim 1 , wherein the plurality of diamond particles have a particle size in the range of from 0.5 micron to 500 microns. 
     
     
         11 . The conditioner disk of  claim 1 , wherein the working diamond ratio is higher than 75%. 
     
     
         12 . The conditioner disk of  claim 1 , wherein the working diamond ratio is higher than 90%. 
     
     
         13 . The conditioner disk of  claim 1 , wherein the plurality of diamond particles are selected from the group consisting of diamond having centered cubic crystal structure, polycrystalline diamond (PCD), diamond-like carbon (DLC), and combinations thereof. 
     
     
         14 . A conditioner disk used in a chemical mechanical process (CMP), comprising:
 a substrate;   a first binder layer comprising at least one first binder disposed over the substrate, wherein the first layer of at least one binder does not completely cover the substrate;   a plurality of diamond particles disposed on the first binder layer at a plurality of locations; and   a second layer of at least one second binder over the substrate,   wherein   at least one top portion of each of the plurality of diamond particles protrudes out of the second layer of at least one second binder and is exposed, and   the plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk contacts a flat surface.   
     
     
         15 . The conditioner disk of  claim 14 , wherein the plurality of diamond particles are selected from the group consisting of diamond having centered cubic crystal structure, polycrystalline diamond (PCD), diamond-like carbon (DLC), and combinations thereof. 
     
     
         16 . The conditioner disk of  claim 14 , wherein the at least one first binder comprises a metal or a thermosetting polymer. 
     
     
         17 . A conditioner disk used in a chemical mechanical process (CMP), comprising:
 a substrate;   a first binder layer comprising at least one first binder disposed over the substrate, wherein the first layer of at least one binder completely covers the substrate;   a plurality of diamond particles disposed on the first binder layer at a plurality of locations; and   a second layer of at least one second binder over the substrate,   wherein   at least one top portion of each of the plurality of diamond particles protrudes out of the second layer of at least one second binder and is exposed, and   the plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk contacts a flat surface.   
     
     
         18 . The conditioner disk of  claim 17 , wherein the plurality of diamond particles are selected from the group consisting of diamond having centered cubic crystal structure, polycrystalline diamond (PCD), diamond-like carbon (DLC), and combinations thereof. 
     
     
         19 . The conditioner disk of  claim 17 , wherein the at least one first binder comprises a metal or a thermosetting polymer. 
     
     
         20 . The conditioner disk of  claim 17 , wherein the plurality of diamond particles are of substantially the same particle size, and are oriented in substantially the same direction as each other.