Cover film

Abstract

The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.

1 . A cover film, comprising:
 a conductive adhesive layer;   an electromagnetic shielding layer formed on the conductive adhesive layer and having a thickness of 0.01 to 25 micrometers; and   an insulating layer formed on the electromagnetic shielding layer, wherein the electromagnetic shielding layer is sandwiched between the conductive adhesive layer and the insulating layer.   
     
     
         2 . The cover film of  claim 1 , wherein the electromagnetic shielding layer has a thickness of from 0.01 to 1.5 micrometers. 
     
     
         3 . The cover film of  claim 1 , wherein the insulating layer has a thickness of from 3 to 75 micrometers. 
     
     
         4 . The cover film of  claim 1 , wherein the insulating layer comprises a first polymer and an additive dispersed in the first polymer. 
     
     
         5 . The cover film of  claim 4 , wherein the first polymer is at least one selected from the group consisting of an epoxy resin, an acrylic resin and a combination thereof. 
     
     
         6 . The cover film of  claim 4 , wherein a content of the additive is between 3 wt % to 15 wt % of the insulating layer. 
     
     
         7 . The cover film of  claim 4 , wherein the additive is at least one selected from the group consisting of carbon powder, titanium dioxide, a colorant, a pigment and a combination thereof. 
     
     
         8 . The cover film of  claim 1 , wherein the electromagnetic shielding layer is made of metal or a resin containing metal powder. 
     
     
         9 . The cover film of  claim 1 , wherein the conductive adhesive layer has a thickness of from 3 to 50 micrometers. 
     
     
         10 . The cover film of  claim 1 , wherein the conductive adhesive layer comprises a second polymer and at least one conductive powder dispersed in the second polymer. 
     
     
         11 . The cover film of  claim 10 , wherein the second polymer is at least one selected from the group consisting of an epoxy resin, a poly-p-xylene resin, a bismaleimide resin, a polyimide resin, an acrylic resin, a urethane resin, a silicon rubber-based resin and a combination thereof. 
     
     
         12 . The cover film of  claim 10 , wherein a content of the conductive powder is between 0.5 wt % to 90 wt % of the conductive adhesive layer. 
     
     
         13 . The cover film of  claim 10 , wherein the at least one conductive powder is at least one selected from the group consisting of gold powder, silver powder, copper powder, nickel powder, aluminum powder, silver coated copper powder, silver coated nickel powder, copper-nickel alloy, iron powder, iron-based alloy, silver-copper alloy, tin-copper alloy, gold plated nickel powder, and silver plated copper powder. 
     
     
         14 . The cover film of  claim 1 , further comprising an electromagnetic absorption layer formed between the electromagnetic shielding layer and the insulating layer. 
     
     
         15 . The cover film of  claim 14 , wherein the electromagnetic absorption layer has a thickness of from 0.1 to 25 micrometers. 
     
     
         16 . The cover film of  claim 14 , wherein the electromagnetic absorption layer comprises a third polymer and at least one magnetic powder dispersed in the third polymer. 
     
     
         17 . The cover film of  claim 16 , wherein the at least one magnetic powder is at least one selected from the group consisting of iron oxide, iron-silicon-aluminum alloy, permalloy (iron-nickel alloy), and iron-silicon-chrome-nickel alloy. 
     
     
         18 . The cover film of  claim 1 , further comprising a release layer formed under the conductive adhesive layer, wherein the conductive adhesive layer is sandwiched between the electromagnetic shielding layer and the release layer. 
     
     
         19 . The cover film of  claim 18 , wherein the release layer has a thickness of from 25 to 100 micrometers. 
     
     
         20 . The cover film of  claim 18 , wherein the release layer is a polyethylene terephthalate (PET) fluorine release film, a PET silicone oil release film, a PET matte release film or a polyethylene release film.