US2016111570A1PendingUtilityA1

Ribbon-free solar cell module and method for preparing same

Assignee: NANJING SUNPORT POWER CO LTDPriority: May 30, 2013Filed: Jul 30, 2013Published: Apr 21, 2016
Est. expiryMay 30, 2033(~6.9 yrs left)· nominal 20-yr term from priority
Y02E10/52H10F 71/00H10F 19/908H10F 19/804H10F 19/80H10F 77/488H10F 19/906H10F 19/85H01L 31/0481H01L 31/18H01L 31/049Y02E10/50
31
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Claims

Abstract

A ribbon-free solar cell module and a method for preparing the same are provided. The solar cell module is in a five-layer structure, including a first layer of conductive back plate, a second layer of conductive adhesive connection joints, a third layer of back contact cells, a fourth layer of packaging material, and a fifth layer of tempered glass which are successively laminated together, wherein the first layer of conductive back plate is in a novel laminated structure. Such a design provides a ribbon-free solar cell module and a method for preparing the same which are low in cost, and easy to implement.

Claims

exact text as granted — not AI-modified
1 . A ribbon-free solar cell module, comprising a first layer of conductive back plate, a second layer of conductive adhesive connection joints, a third layer of back contact cells, a fourth layer of packaging material, and a fifth layer of tempered glass which are successively laminated together, wherein the first layer of conductive back plate employs a back plate layer one of fluoropolymer, a back plate layer two of PET material, a back plate layer three of metal circuit and a back plate layer four of sealing material which are successively laminated together. 
     
     
         2 . The ribbon-free solar cell module according to  claim 1 , wherein the back plate layer three of metal circuit is made of copper or aluminum, and ranges from 20 to 60 um in thickness. 
     
     
         3 . The ribbon-free solar cell module according to  claim 1 , wherein the back plate layer four of sealing material ranges from 50 to 200 um in thickness. 
     
     
         4 . The ribbon-free solar cell module according to  claim 1 , wherein a back plate layer five of isodielectric material and a back plate layer six of sealing material are laminated additionally to the back plate layer four of sealing material; and the total thickness of the back plate layer four of sealing material, the back plate layer five of isodielectric material and the back plate layer six of sealing material ranges from 50 to 200 um. 
     
     
         5 . The ribbon-free solar cell module according to  claim 1 , wherein the different layers of material in the first layer of conductive back plate are made by bonding and hot pressing. 
     
     
         6 . The ribbon-free solar cell module according to  claim 1 , wherein the third layer of back contact cells is interconnected with the back plate layer three of metal circuit by conductive glue cured at a low temperature. 
     
     
         7 . A method for preparing a ribbon-free solar cell module, comprising the following steps:
 (a) printing conductive glue on a first layer of conductive back plate by dispensing or stencil printing, positions for printing conductive adhesive being matched with electrode point positions of a third layer of back contact cells to form a second layer of conductive adhesive connection joints;   (b) placing the third layer of back contact cells accurately on the second layer of conductive adhesive connection joints to ensure that the electrode points of the third layer of back contact points correspond one-to-one with positions of the second layer of conductive adhesive connection joints; and   (c) laying a fourth layer of packaging material and a fifth layer of tempered glass on the third layer of back contact cells.   
     
     
         8 . The method for preparing a ribbon-free solar cell module according to  claim 7 , wherein in the step (a), the curing temperature of the conductive glue ranges from 80 to 140° C.; the conductive glue is made of silicone based or epoxy resin based material, conductive particles dispersed therein being Ag or Ag-plated Cu particles; conductive glue connection joints of the second layer of conductive adhesive connection joints are each in a cylindrical or conical shape, ranging from 1 to 4 mm in base diameter and from 0.1 to 0.5 mm in height.

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