Method for manufacturing electronic devices

Abstract

An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

1 . An integrated circuit, comprising:
 a substrate having a surface;   a conductive pad disposed adjacent to the surface;   a conductive strip having a first end attached to the pad and having a contact region spaced from the substrate; and   a package covering the conductive pad and disposed between the substrate and the contact region of the conductive strip such that a portion of the contact region is exposed through the package and the portion is approximately parallel to the surface of the substrate.   
     
     
         2 . The integrated circuit of  claim 1  wherein:
 the conductive strip has a second end opposite the first end; and 
 the contact region is located at the second end of the conductive strip. 
 
     
     
         3 . The integrated circuit of  claim 1  wherein:
 the conductive strip has a second end opposite the first end, a midportion disposed between, and farther from the substrate than, the first and second ends; and 
 the contact region is located at the midportion of the conductive strip. 
 
     
     
         4 . The integrated circuit of  claim 1  wherein the contact region is located at the first end of the conductive strip. 
     
     
         5 . The integrated circuit of  claim 1  wherein the contact region includes a conductive material disposed over a portion of the conductive strip. 
     
     
         6 . The integrated circuit of  claim 1 , further comprising:
 an edge; and   wherein the contact region of the conductive strip is located at the edge.   
     
     
         7 . The integrated circuit of  claim 1  wherein the contact region includes:
 a first surface approximately parallel to the surface of the substrate; and 
 a second surface approximately perpendicular to the first surface. 
 
     
     
         8 . The integrated circuit of  claim 1 , further comprising an electronic component disposed on the substrate and coupled to the pad. 
     
     
         9 . The integrated circuit of  claim 1 , further comprising an integrated-circuit die disposed over the substrate, covered by the package, and coupled to the pad. 
     
     
         10 . The integrated circuit of  claim 1 , further comprising a microelectromechanical device disposed over the substrate, covered by the package, and coupled to the pad. 
     
     
         11 . The integrated circuit of  claim 1 , further comprising:
 a die disposed over the substrate, covered by the package, and having a conductive pad;   wherein the conductive strip has a second end opposite the first end and attached to the conductive pad of the die, and has a midportion disposed between, and farther from the substrate than, the first and second ends; and   wherein the contact region is located at the midportion of the conductive strip.   
     
     
         12 . A system, comprising:
 a first integrated circuit, including
 a substrate having a surface, 
 a conductive pad disposed adjacent to the surface, 
 a conductive strip having a first end attached to the pad and having a contact region spaced from the substrate, and 
 a package covering the conductive pad and disposed between the substrate and the contact region of the conductive strip such that a portion of the contact region is exposed through the package and the portion is approximately parallel to the surface of the substrate; and 
   a second integrated circuit coupled to the first integrated circuit.   
     
     
         13 . The system of  claim 12  wherein one of the first and second integrated circuits includes a computing circuit. 
     
     
         14 . The system of  claim 12  wherein the first and second integrated circuits are disposed on a same integrated-circuit die. 
     
     
         15 . The system of  claim 12  wherein the first and second integrated circuits are disposed on respective integrated-circuit dies. 
     
     
         16 . An integrated circuit, comprising:
 a first substrate having a surface;   a conductive contact pad disposed adjacent to the surface;   a conductive strip having a contact portion attached to the conductive contact pad and having an end portion spaced from the first substrate; and   a package covering the conductive contact pad and disposed between the first substrate and the end portion of the conductive strip, the end portion including a first exposed contact surface being exposed through the package and the first exposed contact surface being approximately parallel to the surface of the first substrate.   
     
     
         17 . The integrated circuit of  claim 16 , wherein the end portion of the conductive strip further includes a second exposed contact surface exposed through the package with the second exposed contact surface being approximately orthogonal to the first exposed contact surface. 
     
     
         18 . The integrated circuit of  claim 17 , wherein the end portion of the conductive strip further comprises a conductive material disposed over the first and second exposed contact surfaces. 
     
     
         19 . The integrated circuit of  claim 18 , wherein the package further comprises a cavity formed in the package and the substrate further comprises a MEMS device formed in the substrate adjacent the cavity. 
     
     
         20 . The integrated circuit of  claim 16 , wherein the end portion of the conductive strip corresponds to a raised central portion of the conductive strip, and wherein the conductive strip further includes a second contact portion attached to a second conductive contact pad of a second substrate attached to the surface of the first substrate.