Multilayer ceramic device having a crack guide pattern

Abstract

Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.

What is claimed is: 
     
         1 . A multilayer ceramic device, comprising:
 a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides;   an internal electrode disposed in a longitudinal direction of the device body within the device body;   an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and   a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides,   wherein the crack guide pattern includes:   a metal pattern; and   an oxide layer formed on a surface of the metal pattern.   
     
     
         2 . The multilayer ceramic device according to  claim 1 , wherein a thickness of the oxide layer is 0.760 less than that of the crack guide pattern. 
     
     
         3 . The multilayer ceramic device according to  claim 1 , wherein a thickness of the oxide layer is 0.004 as large as that of the crack guide pattern. 
     
     
         4 . The multilayer ceramic device according to  claim 1 , wherein a ratio of a thickness of the oxide layer and a thickness of the crack guide pattern is larger than 0.004 and smaller than 0.760. 
     
     
         5 . The multilayer ceramic device according to  claim 1 , wherein the metal pattern extends from the side to an inside of the device body and an extending length of the metal pattern is equal to or longer than that of the band part. 
     
     
         6 . The multilayer ceramic device according to  claim 1 , wherein the metal pattern includes nickel (Ni) metal and the oxide layer is a nickel oxide layer. 
     
     
         7 . A method for manufacturing a multilayer ceramic device, comprising:
 manufacturing a device body which has sides and a circumferential surface connecting the sides; and   manufacturing an external electrode which covers the sides and a portion of the circumferential surface;   wherein the manufacturing of the device body includes forming a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, and the forming of the crack guide pattern includes:   forming a metal pattern; and   forming an oxide layer on a surface of the metal pattern.   
     
     
         8 . The method according to  claim 7 , wherein the forming of the oxide layer includes controlling a thickness of the oxide layer by controlling a supply amount of oxygen gas for controlling a process atmosphere within a firing furnace used during a firing process for manufacturing the multilayer ceramic device.