Method and system for measuring patterned structures
Abstract
A method and system are presented for determining a line profile in a patterned structure, aimed at controlling a process of manufacture of the structure. The patterned structure comprises a plurality of different layers, the pattern in the structure being formed by patterned regions and un-patterned regions. At least first and second measurements are carried out, each utilizing illumination of the structure with a broad wavelengths band of incident light directed on the structure at a certain angle of incidence, detection of spectral characteristics of light returned from the structure, and generation of measured data representative thereof. The measured data obtained with the first measurement is analyzed, and at least one parameter of the structure is thereby determined. Then, this determined parameter is utilized, while analyzing the measured data obtained with the second measurements enabling the determination of the profile of the structure
Claims
exact text as granted — not AI-modified1 . (canceled)
2 . A method for use in process control of processing copper-based patterned structure having a periodic pattern, the method comprising:
performing optical measurements on a structure while progressing through successive steps of a processing arrangement, and generating measured data indicative of results of the optical measurements; processing the measured data obtained on the structure after being processed in a preceding step of the processing arrangement; and generating data indicative of results of said processing of the measured data, thereby enabling use of said results of said processing for feed forward process control of a successive step of the processing arrangement.Join the waitlist — get patent alerts
Track US2016109225A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.