Non-permeable substrate carrier for electroplating

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

What is claimed is: 
     
         1 . A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
 a non-conductive carrier body for holding the substrates, an area of the non-conductive carrier body that is directly behind the substrates being continuous so as to be impermeable to flow of electroplating solution through the area of the non-conductive carrier body;   a plurality of aligning features on the non-conductive carrier body, wherein the aligning features are arranged to surround and align the substrates; and   electrically-conductive lines embedded within the non-conductive carrier body.   
     
     
         2 . The substrate carrier of  claim 1 , further comprising:
 a plurality of spacing features on the non-conductive carrier body, the spacing features being configured to space the substrates from a top surface of the non-conductive carrier body.   
     
     
         3 . The substrate carrier of  claim 1 , wherein the aligning features are configured to be removable from the carrier body and replaceable with new aligning features. 
     
     
         4 . The substrate carrier of  claim 1 , wherein the aligning features comprise pegs. 
     
     
         5 . The substrate carrier of  claim 4 , wherein the pegs are tapered. 
     
     
         6 . The substrate carrier of  claim 1 , further comprising:
 an electrically-conductive bus bar configured at a top side of the non-conductive carrier body and conductively coupled to the electrically-conductive lines embedded in the non-conductive carrier body.   
     
     
         7 . The substrate carrier of  claim 6 , further comprising:
 a plurality of mounting holes in the bus bar for mounting the substrate carrier onto a work arm for dipping the non-conductive carrier body into, and raising the non-conductive carrier body out of, an electroplating bath while a voltage is applied to the bus bar.   
     
     
         8 . A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
 a non-conductive carrier body;   a holding area on the non-conductive carrier body and over which the substrates are to be held, the entirety of the holding area being continuous so as to be impermeable to flow of electroplating solution through the holding area; and   electrically-conductive lines embedded within the non-conductive carrier body.   
     
     
         9 . The substrate carrier of  claim 8 , wherein the holding area on the non-conductive carrier body comprises a plurality of substrate holding sections, with each of the holding sections being configured to hold a substrate to be electroplated. 
     
     
         10 . The substrate carrier of  claim 9 , wherein each of the substrate holding sections includes pocket indentations. 
     
     
         11 . The substrate carrier of  claim 10 , wherein each of the substrate holding sections includes a ribbing pattern that separates the pocket indentations in the substrate holding section. 
     
     
         12 . The substrate carrier of  claim 11 , wherein the ribbing pattern is X-shaped. 
     
     
         13 . The substrate carrier of  claim 10 , further comprising:
 a plurality of aligning features on the holding area of the non-conductive carrier body, wherein the aligning features are arranged to surround and align the substrates.   
     
     
         14 . The substrate carrier of  claim 13 , wherein the aligning features are configured to be removable from the carrier body and replaceable with new aligning features. 
     
     
         15 . The substrate carrier of  claim 13 , wherein the aligning features comprise pegs. 
     
     
         16 . The substrate carrier of  claim 13 , wherein the pegs are tapered. 
     
     
         17 . A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
 a non-conductive carrier body;   a plurality of substrate holding sections on the non-conductive carrier body, each substrate holding section being configured to hold a substrate to be electroplated and is continuous so as to be impermeable to flow of electroplating solution through the substrate holding section; and   electrically-conductive lines embedded within the non-conductive carrier body.   
     
     
         18 . The substrate carrier of  claim 17 , wherein each of the substrate holding sections includes pocket indentations. 
     
     
         19 . The substrate carrier of  claim 17 , further comprising:
 a plurality of aligning features on each the plurality of substrate holding sections, wherein aligning features on a substrate holding section are arranged to surround and align a substrate to be electroplated.   
     
     
         20 . The substrate carrier of  claim 17 , wherein the aligning features comprise pegs.