Aluminum deposition devices and their use in spot electroplating of aluminum

Abstract

A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising: (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said electrolyte from said at least one aperture onto said metallic substrate to form a coating of said electrolyte thereon, wherein said electrolyte is in contact with an anode; and (ii) applying a voltage potential between the anode and metallic substrate polarized as cathode when the aluminum ion-containing electrolyte is released from said aperture and forms a coating on the metallic substrate, to produce a coating of aluminum on the substrate. Devices, such as brush and ball pen plating devices, for achieving the above-described method are also described.

What is claimed is: 
     
         1 . A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising:
 (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said aluminum ion-containing electrolyte from said at least one aperture onto said metallic substrate to form a coating of said aluminum ion-containing electrolyte onto said metallic substrate, wherein said aluminum ion-containing electrolyte is in contact with an anode; and   (ii) applying a voltage potential between the anode and said metallic substrate as cathode when said aluminum ion-containing electrolyte is released from said aperture and forms a coating on said metallic substrate, wherein said coating of electrolyte conducts electrical current between said anode and metallic substrate, to produce a coating of aluminum on said metallic substrate within an area bounded by the coating of said aluminum ion-containing electrolyte.   
     
     
         2 . The method of  claim 1 , wherein said protective structure is a polymer membrane in which said aluminum ion-containing electrolyte is impregnated, wherein said polymer membrane contains pores for releasing said aluminum ion-containing electrolyte onto the substrate. 
     
     
         3 . The method of  claim 2 , wherein said polymer membrane is laminated with aluminum foil, serving as anode, on a side of the polymer membrane not in contact with the metallic substrate. 
     
     
         4 . The method of  claim 2 , wherein said polymer membrane is constructed of a vinyl-addition polymer. 
     
     
         5 . The method of  claim 2 , wherein said polymer membrane is removed to reveal a freshly coated layer of aluminum within its original bounds. 
     
     
         6 . The method of  claim 1 , wherein said aluminum ion-containing electrolyte comprises a non-aqueous solvent in which aluminum ions and counterions are dissolved. 
     
     
         7 . The method of  claim 1 , wherein said aluminum ion-containing electrolyte comprises an aluminum-containing ionic liquid. 
     
     
         8 . The method of  claim 1 , wherein said protective structure is an applicator device comprising (i) a compartment in which said aluminum ion-containing electrolyte and said anode is contained, and (ii) transferring means for transferring said aluminum ion-containing electrolyte from the compartment through said at least one aperture onto the metallic substrate, wherein said transferring means is in contact with the metallic substrate during electrolyte application and voltage application. 
     
     
         9 . The method of  claim 8 , wherein said applicator device is a brush plating device in which said transferring means comprises fibers. 
     
     
         10 . The method of  claim 8 , wherein said applicator device is a ball pen plating device in which said transferring means is a rotatable ball. 
     
     
         11 . The method of  claim 8 , wherein said anode is at least partially submerged within the aluminum ion-containing electrolyte. 
     
     
         12 . The method of  claim 8 , wherein said compartment is flushed with an inert gas. 
     
     
         13 . The method of  claim 8 , wherein said aluminum ion-containing electrolyte comprises a non-aqueous solvent in which aluminum ions and counterions are dissolved. 
     
     
         14 . The method of  claim 8 , wherein said aluminum ion-containing electrolyte comprises an aluminum-containing ionic liquid. 
     
     
         15 . The method of  claim 1 , wherein said metallic substrate is comprised of at least one metal selected from titanium, iron, cobalt, nickel, copper, and zinc. 
     
     
         16 . A device useful for spot electroplating a metallic substrate with aluminum, the device comprising a protective structure suitable for housing an aluminum ion-containing electrolyte, wherein said protective structure possesses at least one aperture suitable for release of the aluminum ion-containing electrolyte, and wherein said protective structure includes an anode in a location suitable for contacting said aluminum ion-containing electrolyte. 
     
     
         17 . The device of  claim 16 , wherein said protective structure houses said aluminum ion-containing electrolyte. 
     
     
         18 . The device of  claim 16 , wherein said protective structure is a polymer membrane in which said aluminum ion-containing electrolyte is impregnated, wherein said polymer membrane contains pores for releasing said aluminum ion-containing electrolyte onto the substrate. 
     
     
         19 . The device of  claim 18 , wherein said polymer membrane is laminated with aluminum foil, serving as anode, on a side of the polymer membrane, with a portion of the polymer membrane not laminated with aluminum foil, said portion of polymer membrane suitable for contact with the metallic substrate to deposit a coating of aluminum thereon. 
     
     
         20 . The device of  claim 18 , wherein said polymer membrane is constructed of a vinyl-addition polymer. 
     
     
         21 . The device of  claim 16 , wherein said protective structure is an applicator device comprising (i) a compartment suitable for housing said aluminum ion-containing electrolyte and containing said anode, and (ii) transferring means for transferring said aluminum ion-containing electrolyte from the compartment through said at least one aperture onto the metallic substrate by direct contact of the transferring means with the metallic substrate. 
     
     
         22 . The device of  claim 21 , wherein said applicator device is a brush plating device in which said transferring means comprises fibers. 
     
     
         23 . The device of  claim 21 , wherein said applicator device is a ball pen plating device in which said transferring means is a rotatable ball.