Chip electronic component and board having the same

Abstract

There are provided a chip electronic component and aboard having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

What is claimed is: 
     
         1 . A chip electronic component comprising:
 a substrate;   a first internal coil part disposed on one surface of the substrate;   a second internal coil part disposed on the other surface of the substrate opposing one surface thereof;   a via penetrating through the substrate to connect the first and second internal coil parts to each other; and   first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via,   wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.   
     
     
         2 . The chip electronic component of  claim 1 , wherein the portions of the first and second internal coil parts adjacent to the first and second via pads are shaped as recessed portions to be insulated from the first and second via pads. 
     
     
         3 . The chip electronic component of  claim 2 , wherein the centers of the recessed portions and the centers of the first and second via pads coincide with each other. 
     
     
         4 . The chip electronic component of  claim 1 , wherein the first via pad is formed by extending one end portion of the first internal coil part, and
 the second via pad is formed by extending one end portion of the second internal coil part.   
     
     
         5 . The chip electronic component of  claim 1 , wherein the first and second internal coil parts and the first and second via pads are formed by plating. 
     
     
         6 . The chip electronic component of  claim 1 , wherein the first and second via pads and the portions of the first and second internal coil parts adjacent thereto have an interval of 3 μm or more therebetween. 
     
     
         7 . The chip electronic component of  claim 1 , further comprising a magnetic body enclosing the first and second internal coil parts,
 wherein the magnetic body contains a magnetic metal powder.   
     
     
         8 . The chip electronic component of  claim 1 , wherein the substrate has a through hole which is disposed in a central portion of the substrate, and
 the through hole is filled with a magnetic material to form a core part.   
     
     
         9 . The chip electronic component of  claim 7 , wherein end portions of the first and second internal coil parts are extended to form lead portions exposed to at least one surface of the magnetic body. 
     
     
         10 . A board having a chip electronic component, the board comprising:
 a printed circuit board on which first and second electrode pads are provided;   the chip electronic component of  claim 1 , mounted on the printed circuit board.   
     
     
         11 . The board of  claim 10 , wherein the portions of the first and second internal coil parts adjacent to the first and second via pads are shaped as recessed portions to be insulated from the first and second via pads. 
     
     
         12 . The board of  claim 11 , wherein the centers of the recessed portions and the centers of the first and second via pads coincide with each other. 
     
     
         13 . The board of  claim 10 , wherein the first via pad is formed by extending one end portion of the first internal coil part, and
 the second via pad is formed by extending one end portion of the second internal coil part.   
     
     
         14 . The board of  claim 10 , wherein the first and second internal coil parts and the first and second via pads are formed by plating. 
     
     
         15 . The board of  claim 10 , wherein the first and second via pads and the portions of the first and second internal coil parts adjacent thereto have an interval of 3 μm or more therebetween. 
     
     
         16 . The board of  claim 10 , wherein the chip electronic component further includes a magnetic body enclosing the first and second internal coil parts,
 the magnetic body containing magnetic metal powder.   
     
     
         17 . The board of  claim 10 , wherein the substrate has a through hole which is disposed in a central portion of the substrate, and
 the through hole is filled with a magnetic material to form a core part.   
     
     
         18 . The board of  claim 16 , wherein end portions of the first and second internal coil parts are extended to form lead portions exposed to at least one surface of the magnetic body.