US2016093630A1PendingUtilityA1
Double gated flash memory
Assignee: GLOBALFOUNDRIES SG PTE LTDPriority: Aug 10, 2011Filed: Dec 10, 2015Published: Mar 31, 2016
Est. expiryAug 10, 2031(~5 yrs left)· nominal 20-yr term from priority
H10D 30/681H10D 30/0411H10D 30/024H10D 30/6892H10D 64/035H10D 30/6211G11C 16/0408H01L 29/42328H01L 29/7881G11C 16/26H01L 29/7851H01L 27/11521G11C 16/14G11C 16/0425H10B 41/10H10B 41/30
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Claims
Abstract
A split gate memory cell is fabricated with a fin structure between a memory gate stack and a select gate. Embodiments include a first channel region under the memory gate stack and a second channel region under the select gate.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A device comprising:
a fin structure on a substrate; a memory gate stack proximate a first side surface of the fin structure; and a select gate proximate a second side surface of the fin structure.
2 . The device according to claim 1 , comprising:
a first channel region under the memory gate stack; and a second channel region under the select gate.
3 . The device according to claim 2 , wherein the first channel region is for program and/or erase and the second channel region is for read.
4 . The device according to claim 1 , comprising the memory gate stack and the select gate being on opposite side surfaces of the fin structure.
5 . The device according to claim 4 , wherein the memory gate stack comprises:
a floating gate proximate the fin structure; and a control gate proximate the floating gate.
6 . The device according to claim 5 , further comprising an oxide between the select gate and the fin structure and between the floating gate and the fin structure.
7 . The device according to claim 6 , further comprising a dielectric layer between the floating gate and the control gate.
8 . The device according to claim 1 , further comprising:
a second fin structure proximate the select gate.
9 . The device according to claim 8 , further comprising:
a second memory gate stack proximate a side surface of the second fin structure, opposite the select gate.
10 . The device according to claim 1 , further comprising:
a second memory gate stack on the substrate proximate, but separated from the select gate.
11 . The device according to claim 10 , further comprising:
a second fin structure proximate the second memory gate stack; and a second select gate proximate the second fin structure, opposite the second memory gate stack.
12 . A device comprising:
a fin structure on a substrate; a memory gate stack proximate a first side surface of the fin structure; and a select gate proximate a second side surface of the fin structure, wherein the memory gate stack and select gate are substantially coplanar with the upper surface of the fin structure, and the memory gate stack includes a floating gate proximate the fin structure, and a control gate proximate the floating gate.
13 . The device according to claim 12 , comprising:
a first channel region under the memory gate stack; and a second channel region under the select gate.
14 . The device according to claim 13 , wherein the first channel region is for program and/or erase and the second channel region is for read.
15 . The device according to claim 12 , comprising the memory gate stack and the select gate being on opposite side surfaces of the fin structure.
16 . The device according to claim 12 , further comprising an oxide between the select gate and the fin structure and between the floating gate and the fin structure.
17 . The device according to claim 12 , further comprising a dielectric layer between the floating gate and the control gate.
18 . The device according to claim 12 , further comprising:
a second fin structure proximate the select gate.
19 . The device according to claim 18 , further comprising:
a second memory gate stack proximate a side surface of the second fin structure, opposite the select gate.
20 . A device comprising:
a substrate comprising a first fin structure and a second fin structure, separated from the first fin structure; a select gate between the first and second fin structures, proximate a first side surface of each of the first and second fin structures; a floating gate proximate a second side surface of each of the first and second fin structures; a first dielectric layer proximate a side surface of the floating gate material proximate the first fin structure and a second dielectric layer proximate a side surface of the floating gate material proximate the second fin structure; and a control gate proximate the first and second dielectric layers, wherein the select gate material, floating gate material, and first and second fin structures are substantially coplanar.Join the waitlist — get patent alerts
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