Method and apparatus to reduce thermal resistance in a server chassis

Abstract

A server chassis includes add-on cards, interposer elements, and an interconnect subsystem including back planes. The interposer elements are physically connect to the at least two back planes and to the add-on cards therefore electrically coupling the add-on cards to the back planes. The add-on cards are configured in a stacked position such that unobstructed air flows between the add-on cards and through a space defined to be in between the back planes so that unobstructed air flow causes lowering of thermal resistance associated with the server chassis.

What is claimed is: 
     
         1 . A server chassis comprising:
 add-on cards;   interposer elements;   and an interconnect subsystem including at least two back planes, the interposer elements physically connected to the at least two back planes and to the add-on cards therefore electrically coupling the add-on cards to the at least two back planes, the add-on cards being configured in a stacked position such that unobstructed air flows between the add-on cards and through a space defined to be in between the at least two back planes,   
       wherein unobstructed air flow causes lowering of thermal resistance associated with the server chassis. 
     
     
         2 . The server chassis of  claim 1 , wherein the add-on cards are in compliance with an industry-standard protocol.