US2016081185A1PendingUtilityA1
Wired circuit board and producing method thereof
Est. expiryMay 30, 2032(~5.8 yrs left)· nominal 20-yr term from priority
H05K 1/189G11B 5/4873H05K 3/4007G11B 5/486H05K 2201/10083H05K 1/0296G11B 5/484H05K 2201/09072H05K 2201/053G11B 5/4853H05K 2201/0373H05K 3/321H05K 3/06
43
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Claims
Abstract
A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.
Claims
exact text as granted — not AI-modified1 . A wired circuit board, comprising:
a wire; and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board, wherein the terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction, wherein the wire and the terminal are provided integrally in a conductive pattern,
the wired circuit board further comprising:
an insulating base layer formed on the one side of the conductive pattern in the thickness direction; and
a metal supporting board formed on the one side of the insulating base layer in the thickness direction,
wherein the insulating base layer is formed with a base opening exposing the one surface of the terminal in the thickness direction,
wherein the metal supporting board is formed with a support opening exposing the one surface of the terminal in the thickness direction, and
wherein the covering layer is formed of the same material as that of the metal supporting board.
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