Semiconductor device manufacturing method and semiconductor device

Abstract

There is provided a technology by which the position of 1 pin in a tabless package can be recognized easily. The rear surfaces of plural leads are exposed on a rear surface of a resin-sealed body which seals a semiconductor chip etc., a image recognition area is further provided adjacent to 1 pin (lead with index 1), and a rear surface of an identification mark is exposed from the rear surface of the resin-sealed body of the image recognition area. This identification mark is made of the same conductive member as the plural leads.

1 - 9 . (canceled) 
     
     
         10 . A resin-sealed semiconductor device, comprising:
 a semiconductor chip; a plurality of leads made of a conductive member arranged on the periphery of the semiconductor chip; a plurality of conductive wires electrically connecting a plurality of electrode pads of the semiconductor chip and the plurality of leads; an identification mark made of the conductive member arranged near one lead among the plurality of leads; a suspension lead coupled with the identification mark; and a sealed body which seals with a resin the semiconductor chip, a part of front and side surfaces of the plurality of leads, the plurality of conductive wires, front and side surfaces of the identification mark, and a part of front, rear and side surfaces of the suspension lead, wherein:   the rear surfaces of the plurality of leads and the rear surface of the identification mark are exposed on the rear surface of the sealed body.   
     
     
         11 . The semiconductor device according to  claim 10 , wherein the other parts of the side surfaces of the suspension lead are exposed on a side surface of the sealed body. 
     
     
         12 . The semiconductor device according to  claim 10 , wherein the conductive member is copper, and a palladium film is formed on the rear surfaces of the plurality of leads and on the rear surface of the identification mark exposed from the rear surface of the sealed body. 
     
     
         13 . The semiconductor device according to  claim 10 , wherein indexes of the plurality of leads are recognized according to the identification mark.