Eletroplating apparatus for preventing excessive plating of edge
Abstract
An electroplating device for preventing the excessive plating of an edge, and the electroplating device for plating a steel plate between anodes which are formed at a predetermined distance from each other with respect to the center of the steel plate. A cathode edge mask is provided in the proximity of the edge part of a steel plate and blocking the edge part and an anode from being applied with an electric current. Anode edge masks rare respectively provided to the upper and lower portions of the cathode edge mask at a distance from each other and blocking the edge part and anodes from being applied with an electric current.
Claims
exact text as granted — not AI-modified1 . An electroplating apparatus for plating a steel plate between anodes disposed on both sides of the steel plate at a predetermined distance from each other, the electroplating apparatus comprising:
a cathode edge mask disposed adjacent to an edge portion of the steel plate to prevent the edge portion from being electrically connected to a corresponding anode of the anodes; and anode edge masks disposed above and below the cathode edge mask and spaced apart from the cathode edge mask, the anode edge masks preventing the edge portion from being electrically connected to the corresponding anode, whereby the edge portion is prevented from being over-plated.
2 . The electroplating apparatus according to claim 1 , wherein the anode edge mask is able to increase or decrease an area by which the edge portion is prevented from being electrically connected to the corresponding anode depending on a position where the anode edge mask is coupled.
3 . The electroplating apparatus according to claim 2 , further comprising:
a support connected to one surface of the cathode edge mask; connecting portions extending in a top-bottom direction of the support and coupled with the support and the anode edge masks; a mask driving unit coupled with one end of the support to move the cathode edge mask forward and backward; and two or more positioning holes formed in each of the anode edge masks in a direction toward the steel plate, wherein the connecting portions are fitted into the positioning holes.
4 . The electroplating apparatus according to claim 1 , wherein the cathode edge mask has a recess formed in a surface that faces the steel plate, the recess allowing the steel plate to pass through.
5 . The electroplating apparatus according to claim 4 , wherein the recess is inclined to spread in a direction toward the steel plate.
6 . The electroplating apparatus according to claim 1 , wherein each of the cathode edge mask and the anode edge masks is formed of an insulating material.
7 . The electroplating apparatus according to claim 1 , wherein the anode edge masks are formed of a conductive material, and have an insulating layer on surfaces facing the anodes.Join the waitlist — get patent alerts
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