Chemical mechanical polishing conditioner with brushes
Abstract
Provided is a CMP conditioner with brushes comprising: a substrate comprising a surface, multiple concave parts formed in the surface; multiple abrasive assemblies, each abrasive assembly comprising a metal bar and an abrasive particle, the metal bar comprising a connecting end and a dressing end, the abrasive particle mounted in the dressing end of the metal bar and protruding a tip, wherein vertical distances between the tips and a level of the surface are equal; and multiple brushes mounted in the surface, wherein ends of the brushes are higher than the tips, vertical distances between the ends of the brushes and a level of the tips ranging from 0.1 mm to 1 mm. The present invention, with precise control of the vertical distance between the tips and the level of the surface, and of the vertical distance between the ends of the brushes and a level of the tips improves the cleaning ability of the CMP conditioner with brushes for the scraps in holes of the surface of a pad and avoid problems, e.g., scraps in some holes cannot be effectively removed.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A chemical mechanical polishing conditioner with brushes comprising:
a substrate comprising a surface and multiple concave parts, the concave parts formed in the surface; multiple abrasive assemblies mounted in the surface, each of the abrasive assemblies comprising:
a metal bar, the metal bar comprising a connecting end and a dressing end opposite the connecting end, wherein the connecting ends are each respectively mounted in the concave parts; and
an abrasive particle comprising a tip, the abrasive particles mounted in the dressing ends of the metal bars, and the tips protruding from the dressing ends, wherein vertical distances between the tips of the abrasive particles and a level of the surface are equal to form a level of the tips; and
multiple brushes mounted in the surface, ends of the brushes being farther from the surface than the tips of the abrasive particle, vertical distances between the ends of the brushes and the level of the tips of the abrasive particles ranging from 0.1 mm to 1 mm.
2 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the brushes comprise multiple soft brushes and multiple hard brushes, and the soft brushes and the hard brushes are arranged alternatively.
3 . The chemical mechanical polishing conditioner with brushes as claimed in claim 2 , wherein the soft brushes are made of polypropylene or nylon, and the hard brushes are made of polypropylene or nylon.
4 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the substrate comprises multiple drilled holes formed in the surface; the brushes are each respectively mounted in the drilled holes.
5 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the chemical mechanical polishing conditioner with brushes comprises a second substrate, the second substrate is mounted in the surface; the brushes are mounted in the second substrate.
6 . The chemical mechanical polishing conditioner with brushes as claimed in claim 5 , wherein the second substrate is made of polypropylene.
7 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the substrate is circular and the surface is defined into an outer area and a centre area, the outer area encompasses the centre area; the concave parts are formed in the outer area of the surface; the brushes are mounted in the centre area of the surface.
8 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the substrate is circular and the surface is defined into an outer area and a centre area, the outer area encompasses the centre area, and the outer area is defined into an abrasive area and a cleaning area, the abrasive area and the cleaning area are arranged alternatively; the concave parts are formed in the abrasive area of the outer area of the surface; the brushes are mounted in the centre area of the surface and the cleaning area of the outer area of the surface.
9 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the substrate is circular and the surface is defined into an outer area and a centre area, the outer area encompasses the centre area, and the outer area is defined into an abrasive area and a cleaning area, the abrasive area and the cleaning area are arranged alternatively; the concave parts are formed in the abrasive area of the outer area of the surface; the brushes are mounted in the cleaning area of the outer area of the surface.
10 . The chemical mechanical polishing conditioner with brushes as claimed in claim 1 , wherein the vertical distances between the ends of the brushes and the level of the tips of the abrasive particles are equal.Join the waitlist — get patent alerts
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