US2016068711A1PendingUtilityA1
Organic Film CMP Slurry Composition and Polishing Method Using Same
Est. expiryApr 17, 2033(~6.7 yrs left)· nominal 20-yr term from priority
H10P 95/08H10P 52/403H10P 52/402C09G 1/02B24B 1/00C09K 3/1472C09K 3/1454C09K 3/1463C09G 1/04C09G 1/00C09K 13/06B24B 37/044C09G 1/06
52
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Claims
Abstract
The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same.
Claims
exact text as granted — not AI-modified1 . A CMP slurry composition for polishing organic films, comprising:
at least one of polar solvents and non-polar solvents; and a metal oxide abrasive, wherein the composition is acidic and wherein the organic film contains about 50 atom % to 95 atom % of carbon.
2 . The CMP slurry composition according to claim 1 , wherein the organic film has a film density of about 0.5 g/cm 3 to 2.5 g/cm 3 and a hardness of about 0.4 GPa or more.
3 . The CMP slurry composition according to claim 1 , wherein the organic film has a film density of about 1.0 g/cm 3 to 2.0 g/cm 3 and a hardness of about 1.0 GPa or more.
4 . The CMP slurry composition according to claim 1 , wherein the metal oxide abrasive comprises at least one of silica, alumina, ceria, titania, and zirconia.
5 . The CMP slurry composition according to claim 1 , comprising the metal oxide abrasive is present in an amount of about 0.1 wt % to 20 wt %.
6 . The CMP slurry composition according to claim 1 , wherein the CMP slurry composition has a pH of about 6 or less.
7 . The CMP slurry composition according to claim 1 , wherein the CMP slurry composition has a pH of about 5 or less.
8 . The CMP slurry composition according to claim 1 , further comprising an oxidant comprising: at least one of a metal salt in a multivalent oxidation state and a transition metal chelate.
9 . The CMP slurry composition according to claim 8 , comprising the oxidant in an amount of about 0.001 wt % to 15 wt %.
10 . The CMP slurry composition according to claim 8 , comprising the oxidant in an amount of about 0.01 wt % to 5 wt %.
11 . The CMP slurry composition according to claim 8 , wherein the metal salt in a multivalent oxidation state comprises at least one of ceric ammonium salts, ferric nitrates, and ferric chlorides.
12 . The CMP slurry composition according to claim 8 , wherein the transition metal chelate comprises at least one of Fe compounds including propylene diamine tetraacetic acid-Fe, and Mn compounds including propylene diamine tetraacetic acid-Mn.
13 . The CMP slurry composition according to claim 1 , wherein the composition further comprises a pH adjusting agent.
14 . The CMP slurry composition according to claim 1 , wherein the composition further comprises at least one of a polishing accelerator selected from malic acid, citric acid, formic acid, glutaric acid, oxalic acid, phthalic acid, succinic acid, tartaric acid, maleic acid, and malonic acid.
15 . The CMP slurry composition according to claim 1 , wherein the organic film is formed of a composition for preparing organic films comprising a compound having a substituted or unsubstituted aromatic group.
16 . The CMP slurry composition according to claim 15 , wherein
the compound having the substituted aromatic group is substituted with at least one of a functional group represented by Formula A and a functional group represented by Formula B:
*—(O) n -(CH 2 ) m -P(═O)(R)(R′) <Formula A>
*—B(R)(R′) <Formula B>
wherein in Formula A and Formula B, n is 0 or 1, m is an integer from 0 to 10, R and R′ are each independently hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C1 to C20 haloalkyl group, a substituted or unsubstituted C1 to C20 alkylsulfonate group, a substituted or unsubstituted C1 to C20 alkylsulfonyl group, a substituted or unsubstituted C2 to C20 alkylamide group, a substituted or unsubstituted C3 to C20 alkylester group, a substituted or unsubstituted C2 to C20 cyanoalkyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C6 to C30 arylalkyl group, or a substituted or unsubstituted C6 to C30 aryloxy group, or R and R′ are linked to each other to form a substituted or unsubstituted C3 to C20 cycloalkyl group or a substituted or unsubstituted C3 to C20 heterocycloalkyl group.
17 . The CMP slurry composition according to claim 1 , wherein the organic film is formed from a composition for preparing organic film including a material including Formula 2:
wherein in Formula 2, n is 1≦n≦190;
R 1 is hydrogen, a hydroxyl group, a halogen atom, an allyl group, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 heteroalkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof,
R 2 is hydrogen, an amino group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C6 to C20 aryloxy group, a dialkylamino group —NRR′ wherein R and R′ are each independently a substituted or unsubstituted C1 to C10 alkyl group or a substituted or unsubstituted C6 to C10 aryl group, a hydroxyl group, a halogen atom, an allyl group, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 heteroalkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof, and
R 3 is one selected from among substituted or unsubstituted
18 . The CMP slurry composition according to claim 1 , wherein the organic film is formed from a composition for preparing organic film including a material represented by Formula 6:
wherein in Formula 6, R 4 to R 9 and X 1 to X 6 are each independently hydrogen, a hydroxyl group, a halogen atom, an allyl group, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 heteroalkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof,
n 1 to n 6 are each independently 0 to 2, and
2≦n 1 +n 2 +n 3 +n 4 +n 5 +n 6 ≦6.
19 . The CMP slurry composition according to claim 1 , wherein the organic film is formed from a composition for preparing organic film including a polymer containing aromatic groups selected from (i) a compound represented by Formula 7, (ii) a mixture of the compound represented by Formula 7 and a compound represented by Formula 8, and (iii) a compound represented by Formula 9:
wherein in Formula 7 to Formula 9,
m and n are 1≦n≦750, 1≦m≦750, 2<m+n<1500, respectively;
R 10 is one selected from among substituted or unsubstituted
R 11 is hydrogen, a hydroxyl group, a halogen atom, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkylene ether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof;
R 12 is one selected from among substituted or unsubstituted
R 13 is one selected from among substituted or unsubstituted
R 14 is one selected from among substituted or unsubstituted
R 15 is one selected from among substituted or unsubstituted
and
R in R 10 , R 13 , and R 15 is each independently hydrogen, a hydroxyl group, a halogen atom, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof.
20 . The CMP slurry composition according to claim 1 , wherein the organic film has an acid value of about 0 mgKOH/g.
21 . A method for polishing an organic film comprising polishing an organic film using the CMP slurry composition according to claim 1 , wherein the organic film has a carbon content of about 50 atm % to 95 atm %, a film density of about 0.5 g/cm 3 to 2.5 g/cm 3 , and a hardness of about 0.4 GPa or more.Join the waitlist — get patent alerts
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