US2016068711A1PendingUtilityA1

Organic Film CMP Slurry Composition and Polishing Method Using Same

Assignee: SAMSUNG SDI CO LTDPriority: Apr 17, 2013Filed: Apr 17, 2014Published: Mar 10, 2016
Est. expiryApr 17, 2033(~6.7 yrs left)· nominal 20-yr term from priority
H10P 95/08H10P 52/403H10P 52/402C09G 1/02B24B 1/00C09K 3/1472C09K 3/1454C09K 3/1463C09G 1/04C09G 1/00C09K 13/06B24B 37/044C09G 1/06
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Claims

Abstract

The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same.

Claims

exact text as granted — not AI-modified
1 . A CMP slurry composition for polishing organic films, comprising:
 at least one of polar solvents and non-polar solvents; and a metal oxide abrasive,   wherein the composition is acidic and   wherein the organic film contains about 50 atom % to 95 atom % of carbon.   
     
     
         2 . The CMP slurry composition according to  claim 1 , wherein the organic film has a film density of about 0.5 g/cm 3  to 2.5 g/cm 3  and a hardness of about 0.4 GPa or more. 
     
     
         3 . The CMP slurry composition according to  claim 1 , wherein the organic film has a film density of about 1.0 g/cm 3  to 2.0 g/cm 3  and a hardness of about 1.0 GPa or more. 
     
     
         4 . The CMP slurry composition according to  claim 1 , wherein the metal oxide abrasive comprises at least one of silica, alumina, ceria, titania, and zirconia. 
     
     
         5 . The CMP slurry composition according to  claim 1 , comprising the metal oxide abrasive is present in an amount of about 0.1 wt % to 20 wt %. 
     
     
         6 . The CMP slurry composition according to  claim 1 , wherein the CMP slurry composition has a pH of about 6 or less. 
     
     
         7 . The CMP slurry composition according to  claim 1 , wherein the CMP slurry composition has a pH of about 5 or less. 
     
     
         8 . The CMP slurry composition according to  claim 1 , further comprising an oxidant comprising: at least one of a metal salt in a multivalent oxidation state and a transition metal chelate. 
     
     
         9 . The CMP slurry composition according to  claim 8 , comprising the oxidant in an amount of about 0.001 wt % to 15 wt %. 
     
     
         10 . The CMP slurry composition according to  claim 8 , comprising the oxidant in an amount of about 0.01 wt % to 5 wt %. 
     
     
         11 . The CMP slurry composition according to  claim 8 , wherein the metal salt in a multivalent oxidation state comprises at least one of ceric ammonium salts, ferric nitrates, and ferric chlorides. 
     
     
         12 . The CMP slurry composition according to  claim 8 , wherein the transition metal chelate comprises at least one of Fe compounds including propylene diamine tetraacetic acid-Fe, and Mn compounds including propylene diamine tetraacetic acid-Mn. 
     
     
         13 . The CMP slurry composition according to  claim 1 , wherein the composition further comprises a pH adjusting agent. 
     
     
         14 . The CMP slurry composition according to  claim 1 , wherein the composition further comprises at least one of a polishing accelerator selected from malic acid, citric acid, formic acid, glutaric acid, oxalic acid, phthalic acid, succinic acid, tartaric acid, maleic acid, and malonic acid. 
     
     
         15 . The CMP slurry composition according to  claim 1 , wherein the organic film is formed of a composition for preparing organic films comprising a compound having a substituted or unsubstituted aromatic group. 
     
     
         16 . The CMP slurry composition according to  claim 15 , wherein
 the compound having the substituted aromatic group is substituted with at least one of a functional group represented by Formula A and a functional group represented by Formula B:
   *—(O) n -(CH 2 ) m -P(═O)(R)(R′)  <Formula A>
 
   *—B(R)(R′)  <Formula B>
 
   wherein in Formula A and Formula B, n is 0 or 1, m is an integer from 0 to 10,   R and R′ are each independently hydrogen, a hydroxyl group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C1 to C20 haloalkyl group, a substituted or unsubstituted C1 to C20 alkylsulfonate group, a substituted or unsubstituted C1 to C20 alkylsulfonyl group, a substituted or unsubstituted C2 to C20 alkylamide group, a substituted or unsubstituted C3 to C20 alkylester group, a substituted or unsubstituted C2 to C20 cyanoalkyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C6 to C30 arylalkyl group, or a substituted or unsubstituted C6 to C30 aryloxy group, or   R and R′ are linked to each other to form a substituted or unsubstituted C3 to C20 cycloalkyl group or a substituted or unsubstituted C3 to C20 heterocycloalkyl group.   
     
     
         17 . The CMP slurry composition according to  claim 1 , wherein the organic film is formed from a composition for preparing organic film including a material including Formula 2: 
       
         
           
           
               
               
           
         
         wherein in Formula 2, n is 1≦n≦190; 
         R 1  is hydrogen, a hydroxyl group, a halogen atom, an allyl group, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 heteroalkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof, 
         R 2  is hydrogen, an amino group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C6 to C20 aryloxy group, a dialkylamino group —NRR′ wherein R and R′ are each independently a substituted or unsubstituted C1 to C10 alkyl group or a substituted or unsubstituted C6 to C10 aryl group, a hydroxyl group, a halogen atom, an allyl group, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 heteroalkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof, and 
         R 3  is one selected from among substituted or unsubstituted 
       
       
         
           
           
               
               
           
         
       
     
     
         18 . The CMP slurry composition according to  claim 1 , wherein the organic film is formed from a composition for preparing organic film including a material represented by Formula 6: 
       
         
           
           
               
               
           
         
         wherein in Formula 6, R 4  to R 9  and X 1  to X 6  are each independently hydrogen, a hydroxyl group, a halogen atom, an allyl group, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 heteroalkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof, 
         n 1  to n 6  are each independently 0 to 2, and 
         2≦n 1 +n 2 +n 3 +n 4 +n 5 +n 6 ≦6. 
       
     
     
         19 . The CMP slurry composition according to  claim 1 , wherein the organic film is formed from a composition for preparing organic film including a polymer containing aromatic groups selected from (i) a compound represented by Formula 7, (ii) a mixture of the compound represented by Formula 7 and a compound represented by Formula 8, and (iii) a compound represented by Formula 9: 
       
         
           
           
               
               
           
         
         wherein in Formula 7 to Formula 9, 
         m and n are 1≦n≦750, 1≦m≦750, 2<m+n<1500, respectively; 
         R 10  is one selected from among substituted or unsubstituted 
       
       
         
           
           
               
               
           
         
         R 11  is hydrogen, a hydroxyl group, a halogen atom, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkylene ether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof; 
         R 12  is one selected from among substituted or unsubstituted 
       
       
         
           
           
               
               
           
         
         R 13  is one selected from among substituted or unsubstituted 
       
       
         
           
           
               
               
           
         
         R 14  is one selected from among substituted or unsubstituted 
       
       
         
           
           
               
               
           
         
         R 15  is one selected from among substituted or unsubstituted 
       
       
         
           
           
               
               
           
         
         and 
         R in R 10 , R 13 , and R 15  is each independently hydrogen, a hydroxyl group, a halogen atom, a thionyl group, a thiol group, a cyano group, a substituted or unsubstituted amino group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C1 to C30 heterocycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkenyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, a substituted or unsubstituted C2 to C30 heteroarylalkyl group, a substituted or unsubstituted C1 to C20 alkylamine group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C1 to C20 aldehyde group, a substituted or unsubstituted C1 to C40 alkylether group, a substituted or unsubstituted C7 to C20 arylalkyleneether group, a substituted or unsubstituted C1 to C30 haloalkyl group, a functional group including P, a functional group including B, or a combination thereof. 
       
     
     
         20 . The CMP slurry composition according to  claim 1 , wherein the organic film has an acid value of about 0 mgKOH/g. 
     
     
         21 . A method for polishing an organic film comprising polishing an organic film using the CMP slurry composition according to  claim 1 , wherein the organic film has a carbon content of about 50 atm % to 95 atm %, a film density of about 0.5 g/cm 3  to 2.5 g/cm 3 , and a hardness of about 0.4 GPa or more.

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