US2016064503A1PendingUtilityA1

Electronic devices and method of fabricating the same

Assignee: KOREA ELECTRONICS TELECOMMPriority: Jul 30, 2012Filed: Nov 9, 2015Published: Mar 3, 2016
Est. expiryJul 30, 2032(~6 yrs left)· nominal 20-yr term from priority
Y02E10/52H10K 59/80515H10D 64/60H10F 77/211H10D 64/27H10H 20/032H10H 20/835H10H 20/832H10F 77/707H10F 77/48H10F 77/20H01L 31/0224H01L 29/43H01L 29/423H01L 51/5203H01L 33/40H10K 50/813H10K 50/805
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Claims

Abstract

An electronic device includes a substrate. A lower electrode is disposed on the substrate and has a flat portion and protrusions. An intermediate layer is on the lower electrode. An upper electrode is on the intermediate layer. The lower electrode includes an alloy of a first metal and a second metal. The protrusions have a content ratio of the second metal higher than that of the flat portion.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electronic device comprising:
 a substrate;   a lower electrode disposed on the substrate and having a flat portion and protrusions;   an intermediate layer on the lower electrode; and   an upper electrode on the intermediate layer,   wherein the lower electrode comprises an alloy of a first metal and a second metal, and   the protrusions have a content ratio of the second metal higher than that of the flat portion.   
     
     
         2 . The electronic device of  claim 1 , further comprising a conductive film disposed between the substrate and the lower electrode,
 wherein the conductive film comprises the first metal.   
     
     
         3 . The electronic device of  claim 1 , wherein the first metal comprises copper, and the second metal comprises silver. 
     
     
         4 . The electronic device of  claim 1 , wherein the intermediate layer comprises at least one of silicon (Si), silicon germanium (SiGe), silicon carbide (SiC), silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon carbonitride (SiCN), silicon germanium oxide (SiGeO), silicon germanium oxynitride (SiGeON), silicon germanium carbide (SiGeC), a chalcopyrite-based compound semiconductor, and a Group II-IV compound semiconductor. 
     
     
         5 . The electronic device of  claim 1 , wherein the intermediate layer comprises a light absorbing layer generating electrical power from light. 
     
     
         6 . The electronic device of  claim 1 , wherein the intermediate layer comprises an organic light-emitting material. 
     
     
         7 . The electronic device of  claim 1 , wherein the intermediate layer comprises an inorganic light-emitting material. 
     
     
         8 . An electronic device comprising:
 a substrate;   a conductive film disposed on the substrate and including a first metal;   a lower electrode disposed on the substrate and including the first metal and a second metal;   an intermediate layer on the lower electrode; and   an upper electrode on the intermediate layer,   wherein the lower electrode comprises:   a flat portion on the conductive film; and   protrusions extending from the flat portion.   
     
     
         9 . The electronic device of  claim 8 , wherein the protrusions have a content ratio of the second metal higher than that of the flat portion. 
     
     
         10 . The electronic device of  claim 8 , wherein the protrusions have the same content ratio of the second metal as that of the flat portion.

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