US2016060178A1PendingUtilityA1

Method and Apparatus for Sintering Flat Ceramics

Assignee: NITTO DENKO CORPPriority: Apr 18, 2012Filed: Nov 5, 2015Published: Mar 3, 2016
Est. expiryApr 18, 2032(~5.7 yrs left)· nominal 20-yr term from priority
C04B 35/44C04B 2235/9638C04B 35/6263C04B 35/58C04B 35/505B32B 18/00C04B 2237/562C04B 35/63488C04B 35/6261C04B 35/64C04B 35/632C04B 2235/6565C04B 2235/6562C04B 2237/343C04B 2235/6581C04B 2237/704C04B 2235/441C04B 2235/9653C04B 2237/567C04B 2235/3418C04B 2235/763C04B 35/6342C04B 35/14C04B 35/50C04B 2235/612C04B 35/597C04B 2235/3224C04B 38/067C04B 2235/9646C04B 2235/6025C04B 2235/963C04B 2235/5409C04B 2235/3225C04B 38/0038
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Claims

Abstract

A method and apparatus for sintering flat ceramics using a mesh or lattice is described herein.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A method of sintering a ceramic to produce a sintered ceramic plate, comprising:
 heating a ceramic precursor material between a first mesh and a second mesh;   wherein at least a first portion of the ceramic precursor material contacts the first mesh and at least a second portion of the ceramic precursor material contacts the second mesh during heating,   thereby producing a sintered ceramic plate.   
     
     
         2 . The method of  claim 1 , wherein either or both of the first mesh and the second mesh comprise heat conductive material, the heat conductive material comprising stainless steel, iron, iron alloys, copper, copper alloys, niobium, niobium alloys, molybdenum, molybdenum alloys, nickel, nickel alloys, platinum, platinum alloys, tantalum, tantalum alloys, titanium, titanium alloys, tungsten, tungsten alloys, rhenium, rhenium alloys, or any combination thereof. 
     
     
         3 . The method of  claim 2 , wherein the heat conductive material comprises a tungsten:molybdenum alloy. 
     
     
         4 . The method of  claim 3 , wherein the tungsten:molybdenum alloy is about 3% molybdenum. 
     
     
         5 . The method of  claim 1 , wherein the ceramic precursor material slidably contacts the first mesh and/or the second mesh at a plurality of substantially periodic and/or substantially uniformly distributed contact points or lines. 
     
     
         6 . The method of  claim 5 , further comprising applying sufficient pressure to the precursor material to reduce camber of the sintered ceramic plate but allow sliding engagement of the ceramic precursor material with the first mesh and the second mesh, wherein the applying sufficient pressure comprises placing a metal plate of about 0.1 gm/cm2 to about 20 gm/cm2 on the first mesh. 
     
     
         7 . The method of  claim 1 , wherein the ceramic precursor material is a product of a slurry of solvent, binder and ceramic particles that have been heated at a sufficiently high temperature to evaporate or burn substantially all of the binder and solvent. 
     
     
         8 . The method of  claim 1 , wherein camber of the sintered ceramic plate is less than 50 μm/mm2 vertical displacement. 
     
     
         9 . The method of  claim 1 , wherein either or both of the first mesh and the second mesh have a mesh size of more than about 30 wires per inch to about 100 wires per inch, and a wire diameter of less than 400 μm. 
     
     
         10 . The method of  claim 1 , wherein either or both of the first mesh and the second mesh is configured as a plain weave or as a twill weave. 
     
     
         11 . The method of  claim 1 , wherein the ceramic precursor material is in the form of an unsintered ceramic compact comprising an oxide material, a garnet material, a nitride material, and/or an oxynitride material. 
     
     
         12 . The method of  claim 11 , wherein the oxide material comprises a metallic element or silicon. 
     
     
         13 . The method of  claim 11 , wherein the garnet material comprises yttrium. 
     
     
         14 . The method of  claim 11 , wherein the oxynitride material comprises a metallic element or silicon. 
     
     
         15 . The method of  claim 1 , wherein either or both of the first mesh and the second mesh comprise wires intersecting at an angle of about 10°, about 15°, about 30°, about 45°, about 60°, about 80°, or about 90°. 
     
     
         16 . The method of  claim 1 , wherein either or both of the first mesh and the second mesh have a mesh size that is the same in both dimensions, and the mesh size is about 40×40 wires per inch, about 50×50 wires per inch, about 60×60 wires per inch, about 70×70 wires per inch, or about 80×80 wires per inch. 
     
     
         17 . The method of  claim 1 , wherein the sintered ceramic plate comprises an optionally doped yttrium aluminum garnet and/or an optionally doped lutetium aluminum garnet. 
     
     
         18 . The method of  claim 17 , wherein the yttrium aluminum garnet is a gadolinium-doped yttrium aluminum garnet. 
     
     
         19 . A sintered ceramic plate produced according to the method of  claim 1 . 
     
     
         20 . A lighting device comprising the sintered ceramic plate of  claim 19 .

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