Chip electronic component and board having the same

Abstract

There are provided a chip electronic component including: a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern, wherein each of the external electrodes includes a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern and a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.

What is claimed is: 
     
         1 . A chip electronic component comprising:
 a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and   external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern,   wherein each of the external electrodes includes:   a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern; and   a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.   
     
     
         2 . The chip electronic component of  claim 1 , wherein the first plating layer has a thickness of 1 μm or more. 
     
     
         3 . The chip electronic component of  claim 1 , wherein the conductive resin layer has a thickness of 20 μm or less. 
     
     
         4 . The chip electronic component of  claim 1 , wherein the conductive resin layer contains one or more selected from the group consisting of copper and nickel, and a thermosetting resin. 
     
     
         5 . The chip electronic component of  claim 1 , wherein the magnetic body contains magnetic metal particles and a thermosetting resin. 
     
     
         6 . The chip electronic component of  claim 5 , wherein the magnetic metal particles contain one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni. 
     
     
         7 . The chip electronic component of  claim 1 , wherein the first plating layer is formed of one or more selected from the group consisting of copper and nickel. 
     
     
         8 . The chip electronic component of  claim 1 , further comprising a second plating layer disposed on the conductive resin layer. 
     
     
         9 . The chip electronic component of  claim 8 , wherein the second plating layer includes a nickel (Ni) layer and a tin (Sn) layer which are sequentially disposed. 
     
     
         10 . A board having a chip electronic component, the board comprising:
 a printed circuit board on which first and second electrode pads are formed; and   the chip electronic component of  claim 1 , mounted on the printed circuit board.   
     
     
         11 . The board of  claim 10 , wherein the first plating layer has a thickness of 1 μm or more. 
     
     
         12 . The board of  claim 10 , wherein the conductive resin layer has a thickness of 20 μm or less. 
     
     
         13 . The board of  claim 10 , wherein the conductive resin layer contains one or more selected from the group consisting of copper and nickel, and a thermosetting resin. 
     
     
         14 . The board of  claim 10 , wherein the magnetic body contains magnetic metal particles and a thermosetting resin. 
     
     
         15 . The board of  claim 14 , wherein the magnetic metal particles contain one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni. 
     
     
         16 . The board of  claim 10 , wherein the first plating layer is formed of one or more selected from the group consisting of copper and nickel. 
     
     
         17 . The board of  claim 10 , further comprising a second plating layer disposed on the conductive resin layer. 
     
     
         18 . The board of  claim 17 , wherein the second plating layer includes a nickel (Ni) layer and a tin (Sn) layer which are sequentially disposed.