Plating film, method of manufacturing plating film, and plated product

Abstract

There are provided a plating film having high durability and high reliability, a method of manufacturing the plating film, and a plated product using the plating film. The plating film according to the disclosure is formed with use of a solvent in which a metallic salt is dissolved and a compound having functionality is dissolved or colloidally dispersed, and the metal and the compound having the functionality are homogenously dispersed and joined.

1 . A plating film including a metal and a compound having functionality, the metal and the compound being homogenously dispersed and joined. 
     
     
         2 . The plating film according to  claim 1 , wherein the metal and the compound having the functionality are joined at a molecular level. 
     
     
         3 . The plating film according to  claim 1 , wherein the compound having the functionality includes one or more of water repellency, oil repellency, and surface lubricity. 
     
     
         4 . The plating film according to  claim 1 , wherein the metal and the compound having the functionality are coprecipitated by electrolytic plating. 
     
     
         5 . A method of manufacturing a plating film, the method using a solution in which a metal is dissolved and a compound having functionality is dissolved or colloidally dispersed. 
     
     
         6 . The method of manufacturing the plating film according to  claim 5 , comprising:
 preparing a plating solution by dissolving a metallic salt of the metal in a solvent and then adding the compound having the functionality in the solvent to dissolve or colloidally disperse the compound; and   immersing an object to be plated in the plating solution to make a cathode, and applying a voltage between the cathode and an anode.   
     
     
         7 . The method of manufacturing the plating film according to  claim 6 , wherein
 the object to be plated is immersed in the plating solution to make the cathode, and the voltage is applied between the cathode and the anode to coprecipitate the metal and the compound having the functionality, thereby forming a plating film added with a function of the compound having the functionality.   
     
     
         8 . The method of manufacturing the plating film according to  claim 6 , wherein
 the solvent in which the metallic salt is dissolved is an organic solvent or mixed solution of the organic solvent and water.   
     
     
         9 . The method of manufacturing the plating film according to  claim 8 , wherein
 the organic solvent contains a non-polymerizable compound, or one of a monomer and a polymer of a polymerizable compound.   
     
     
         10 . The method of manufacturing the plating film according to  claim 8 , wherein
 the organic solvent contains one or more kinds of polymerizable compounds, and each of the polymerizable compounds includes two or more kinds of compounds having respective polymerization degrees different from one another.   
     
     
         11 . The method of manufacturing the plating film according to  claim 7 , wherein
 the plating film is formed by electrolytic plating.   
     
     
         12 . The method of manufacturing the plating film according to  claim 11 , wherein
 the electrolytic plating is carried out by application of one of a DC voltage and an AC voltage.   
     
     
         13 . A plated product comprising
 a plating film on a surface, wherein   the plating film includes a metal and a compound having functionality, the metal and the compound being homogenously dispersed and joined.