Film-forming metal soution and metal film-forming method

Abstract

A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation is provided. In the film formation, the solid electrolyte membrane is disposed between an anode and a substrate as a cathode, and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane, so that a metal film of the metal is formed on the surface of the substrate. The film-forming metal solution contains a solvent, and the metal dissolved in the solvent in an ionic state. A hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10 −7.85 mol/L at 25° C.

What is claimed is: 
     
         1 . A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation in which the solid electrolyte membrane is disposed between an anode and a substrate as a cathode, and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane to form a metal film of the metal on the surface of the substrate,
 the film-forming metal solution comprising:   a solvent; and   the metal dissolved in the solvent in an ionic state,   wherein a hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10 −7.85  mol/L at 25° C.   
     
     
         2 . The film-forming metal solution according to  claim 1 , wherein the solvent is an alcoholic solvent containing at least one selected from methanol, ethanol and propanol, or a solvent containing the alcoholic solvent and water. 
     
     
         3 . The film-forming metal solution according to  claim 1 , wherein the metal has a higher ionization tendency than an ionization tendency of hydrogen. 
     
     
         4 . The film-forming metal solution according to  claim 3 , wherein the metal is nickel. 
     
     
         5 . A metal film-forming method, wherein, while the metal ions are supplied to the solid electrolyte membrane by bringing the film-forming metal solution according to  claim 1  into contact with the solid electrolyte membrane, a voltage is placed between the anode and the substrate to form the metal film on the surface of the substrate.