Multilayer fluidic devices and methods for their fabrication
Abstract
A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.
Claims
exact text as granted — not AI-modified1 . A method for making a multilayer device, comprising
(a) providing an inorganic solid support and an organic solid support, wherein the inorganic solid support comprises a rigid structure; (b) providing a radiation-absorbing material, wherein the radiation-absorbing material is not a metal; (c) contacting the inorganic solid support, the organic solid support and the radiation-absorbing material in a configuration wherein the radiation-absorbing material is present at an interface between the inorganic solid support and the organic solid support; and (d) applying compression at the interface and irradiating the radiation-absorbing material with the radiation to form a bonding layer between the inorganic solid support and the organic solid support.
2 . The method of claim 1 , wherein the multilayer device comprises a fluidic device having a channel formed by attachment of the inorganic solid support to the organic solid support.
3 . (canceled)
4 . (canceled)
5 . The method of claim 2 , wherein the creating of the chemically reactive layer comprises silanizing the surface of the inorganic layer.
6 - 8 . (canceled)
9 . The method of claim 1 , wherein the radiation passes through the inorganic layer or through the organic layer during the irradiating of the radiation-absorbing layer.
10 . The method of claim 1 , wherein the irradiating forms covalent bonds between the inorganic solid support and the organic solid support.
11 . (canceled)
12 . The method of claim 1 , wherein the organic solid support has a rigid structure and the irradiating softens the inorganic support or the organic solid support to create contact at the interface.
13 . (canceled)
14 . The method of claim 1 , wherein the organic solid support comprises a thermoplastic and wherein the inorganic solid support comprises glass.
15 . The method of claim 1 , wherein the radiation-absorbing material comprises a dye or carbon black.
16 . The method of claim 1 , wherein the inorganic solid support comprises indium tin oxide.
17 . (canceled)
18 . The method of claim 1 , further comprising
(e) providing a second inorganic solid support; (f) contacting the second inorganic solid support with the organic solid support in a configuration wherein the radiation-absorbing material is present at a second interface between the second inorganic solid support and the organic solid support; and (g) applying compression at the second interface and irradiating the radiation-absorbing material with the radiation to form a bonding layer between the second inorganic solid support and the organic solid support.
19 . (canceled)
20 . (canceled)
21 . A fluidic device comprising
(a) an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer comprises a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support, wherein the material that absorbs the radiation is not a metal, and (b) at least one channel formed by the attachment of the inorganic solid support to the organic solid support, wherein the channel is configured to contain a liquid and the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow.
22 . The fluidic device of claim 21 , wherein the organic solid support has a rigid structure.
23 . The fluidic device of claim 21 , wherein the organic solid support comprises a thermoplastic.
24 . The fluidic device of claim 21 , wherein the inorganic solid support comprises glass.
25 . (canceled)
26 . The fluidic device of claim 21 , wherein the material that absorbs radiation comprises a dye or carbon black.
27 . The fluidic device of claim 21 , further comprising a conducting layer between the inorganic solid support and the material that absorbs the radiation.
28 . (canceled)
29 . (canceled)
30 . The fluidic device of claim 21 , wherein the organic solid support is further attached to a second inorganic solid support, whereby the organic solid support is sandwiched between the inorganic solid support and the second inorganic solid support.
31 . The fluidic device of claim 30 , wherein the second inorganic solid support is attached to the organic solid support by a second bonding layer that comprises the material that absorbs radiation at the wavelength that is transmitted by the inorganic solid support or the organic solid support.
32 . (canceled)
33 . (canceled)
34 . The fluidic device of claim 21 , further comprising an array of nucleic acid features attached to the inorganic solid support in the at least one channel.
35 - 37 . (canceled)
38 . A fluidic device comprising at least one channel defined by an inorganic solid support attached to an organic solid support by a bonding layer, wherein the fluidic device is made by the process of:
(a) contacting the inorganic solid support, the organic solid support and a radiation-absorbing material in a configuration wherein the radiation-absorbing material is present at an interface between the inorganic solid support and the organic solid support, wherein the radiation-absorbing material is not a metal; and (b) applying compression at the interface and irradiating the radiation-absorbing material with the radiation to form the bonding layer between the inorganic solid support and the organic solid support.Join the waitlist — get patent alerts
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