Liquid submerged, horizontal computer server rack and systems and method of cooling such a server rack

Abstract

A system for cooling a plurality of servers containing heat generating electronic components, the system including a tank having a fluid inlet and a fluid outlet and a dielectric liquid. The dielectric liquid enters the tank via the fluid inlet at a first temperature equal to or greater than 90 degrees F. and exits the tank via the fluid outlet at a second greater than the first temperature.

We claim: 
     
         1 . A system for cooling a plurality of servers containing heat generating electronic components, the system comprising:
 a tank comprising a fluid inlet and a fluid outlet; and   a dielectric liquid,   wherein the dielectric liquid enters the tank via the fluid inlet at a first temperature equal to or greater than 90 degrees F. and exits the tank via the fluid outlet at a second greater than the first temperature.   
     
     
         2 . The system of  claim 1 , wherein the first temperature is a temperature in the range of 90 degrees F. to 130 degrees F. 
     
     
         3 . The system of  claim 1 , wherein the first temperature is equal to or greater than 110 degrees F. 
     
     
         4 . The system of  claim 3 , wherein the first temperature is a temperature in the range of 100 degrees F. to 110 degrees F. 
     
     
         5 . The system of  claim 1 , wherein the plurality of servers are independently operable. 
     
     
         6 . The system of  claim 1 , wherein the tank comprises an open or openable top sized to receive at least one row comprising a plurality of rack-mountable servers, each of the plurality of rack-mountable servers in the at least one row comprising a motherboard and heat producing components mounted to the motherboard. 
     
     
         7 . The system of  claim 6 , further comprising one or more mounting members positioned within the interior volume and configured to mountably receive the plurality of rack-mountable servers within the interior volume, wherein the mounting members are configured to hold at least two of the plurality of rack-mountable servers in the at least one row in a horizontally stacked relationship with one another, with the rack-mountable servers configured in a vertical orientation such that the motherboard of the rack-mountable server is vertically oriented, wherein vertically oriented is aligned parallel to a force of gravity. 
     
     
         8 . The system of  claim 7 , further comprising a first heat exchanger fluidly connected to the tank. 
     
     
         9 . The system of  claim 8 , wherein the first heat exchanger is located remotely from the tank. 
     
     
         10 . The system of  claim 8 , further comprising a second heat exchanger thermally connected to the first heat exchanger. 
     
     
         11 . The system of  claim 10 , wherein the second heat exchanger is located remotely from the tank. 
     
     
         12 . The system of  claim 11 , wherein the second heat exchanger and the first heat exchanger are thermally connected with a heat exchange liquid. 
     
     
         13 . The system of  claim 10 , further comprising a controller configured to monitor one or more operational parameters of cooling of the plurality of servers and to adjust heat removed from the dielectric liquid based on the monitoring. 
     
     
         14 . A method of cooling a plurality of servers containing heat generating electronic components comprising:
 immersing the plurality of servers in a dielectric coolant in a tank;   flowing the dielectric coolant over the plurality of servers,   wherein the dielectric liquid enters the tank via a fluid inlet at a first temperature equal to or greater than 90 degrees F. and exits the tank via a fluid outlet at a second temperature greater than the first temperature.   
     
     
         15 . The method of  claim 14 , where the first temperature is equal to or greater than 110 degrees F. 
     
     
         16 . The method of  claim 14 , further comprising flowing the dielectric liquid from the tank to a first heat exchanger fluidly connected to the tank. 
     
     
         17 . The method of  claim 16 , wherein a second heat exchanger is thermally connected to the first heat exchanger with a heat exchange liquid. 
     
     
         18 . The method of  claim 17 , further comprising monitoring one or more operational parameters of cooling of the plurality of servers and adjusting an amount of heat removed from the dielectric liquid based on the monitoring. 
     
     
         19 . The method of  claim 18 , further comprising using the removed heat to heat a building, operate a heat pump, generate electricity, heat water or combinations thereof. 
     
     
         20 . The method of  claim 17 , further comprising monitoring one or more operational parameters of cooling of the plurality of servers and adjusting a flow rate of the dielectric liquid into the tank. 
     
     
         21 . The method of  claim 17 , wherein the second heat exchanger comprises a cooling tower, a fan, a heat engine, an electrical generator or combinations thereof. 
     
     
         22 . The method of  claim 14 , wherein the plurality of severs is configured in a horizontal array. 
     
     
         23 . The method of  claim 18 , wherein the heat removed minimizes the energy to cool the plurality of servers.